TSMC

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Taiwan Semiconductor Manufacturing Company Limited

logo
legal form Corporation
ISIN US8740391003
founding February 21, 1987
Seat Hsinchu , TaiwanTaiwanRepublic of China (Taiwan) 
management CC Wei ( CEO )
Number of employees 45,272 (2015)
sales 843 billion TWD (24.3 billion euros ) (2015)
Branch Semiconductor industry
Website www.tsmc.com

The Taiwan Semiconductor Manufacturing Company Limited ( TSMC ; Chinese  台灣積體電路製造股份有限公司 , short Chinese  台積公司 , Pinyin Taiji Gongsi ) after Intel and Samsung the world's third largest semiconductor manufacturer and the world's largest independent contract manufacturer for semiconductor products ( Foundry ) . It was founded in 1987. The head office and the most important parts of the company are located in Hsinchu , Taiwan .

The business model is aimed at fabless companies such as B. AMD , Apple , Qualcomm , NVIDIA , Conexant , Marvell , VIA or Broadcom to take over the production of semiconductor chips .

The company is extremely profitable and growing rapidly. Over the past 20 years, the average annual growth has been 21.5%. On average, after-tax returns of more than 30% were achieved.

Data

The shares are traded on the Taiwan Stock Exchange and the New York Stock Exchange under the symbol TSM. The company was chaired by Morris Chang for many decades and CEO until 2005 . Rick Tsai was CEO from 2005 to 2009 , who was then replaced by Morris Chang. Chang remained active until the summer of 2018, when Mark Liu has served as chairman and CC Wei as CEO and vice chairman.

On October 13, 2016, the market capitalization was 141.42 billion euros.

Financial data (in billions TWD )
Period sales Profit growth Return
KJ 1993 12 4th unknown 34%
KJ 1994 19th 8th 57% 44%
KJ 1995 29 15th 49% 52%
KJ 1996 39 19th 37% 49%
KJ 1997 44 18th 11% 41%
KJ 1998 50 15th 15% 30%
KJ 1999 73 25th 45% 34%
KJ 2000 166 65 127% 39%
2001 year 126 14th −24% 12%
2002 year 162 22nd 29% 13%
2003 year 203 47 25% 23%
2004 year 257 92 27% 36%
2005 year 267 94 4% 35%
2006 year 317 127 19% 40%
2007 CY 323 109 2% 34%
2008 year 333 100 3% 30%
KJ 2009 296 89 −11% 30%
2010 year 420 162 42% 39%
2011 year 427 134 2% 31%
2012 year 506 166 19% 33%
2013 CY 597 188 18% 31%
2014 year 763 264 28% 35%
2015 year 843 307 11% 36%
Q1 2016 203 65 −8% 32%
Q2 2016 222 73 8th % 33%
Q3 2016 260 97 23% 37%

Works

Fab-5 building
Overview of current production facilities
designation Location category Capacity per month
when fully expanded
Remarks
Fab 12A Hsinchu
( 24 ° 46 ′ 27.9 ″  N , 121 ° 0 ′ 57.7 ″  E )
300 mm movement at the same time company headquarters
Fab 12B Hsinchu
( 24 ° 46 ′ 37 ″  N , 120 ° 59 ′ 35 ″  E )
300 mm movement TSMC R&D Center
Fab 14 Shanhua, Tainan
( 23 ° 6 ′ 46.2 ″  N , 120 ° 16 ′ 26.9 ″  E )
300 mm movement
Fab 15 Taichung
( 24 ° 12 ′ 41.3 ″  N , 120 ° 37 ′ 2.4 ″  E )
300 mm movement
Fab 16 Nanjing , China
( 31 ° 58 ′ 33 ″  N , 118 ° 32 ′ 36 ″  E )
300 mm movement TSMC Nanjing Company Limited


Fab 18 Shanhua (Tainan)
( 23 ° 7 ′ 5 ″  N , 120 ° 15 ′ 45 ″  E )
300 mm movement


Fab 3 Hsinchu
( 24 ° 46 ′ 31 ″  N , 120 ° 59 ′ 28 ″  E )
200 mm movement
Fab 5 Hsinchu
( 24 ° 46 ′ 25 ″  N , 120 ° 59 ′ 55 ″  E )
200 mm movement
Fab 6 Shanhua, Tainan
( 23 ° 6 ′ 36.2 ″  N , 120 ° 16 ′ 24.7 ″  E )
200 mm movement
Fab 8 Hsinchu
( 24 ° 45 ′ 44 ″  N , 121 ° 1 ′ 11 ″  E )
200 mm movement


Fab 10 Songjiang, China
( 31 ° 2 ′ 7.6 ″  N , 121 ° 9 ′ 33 ″  E )
200 mm movement TSMC China Company Limited
Fab 11 Camas , Washington , USA
( 45 ° 37 ′ 7.7 ″  N , 122 ° 27 ′ 20 ″  E )
200 mm movement WaferTech LLC; 100% owned by TSMC
SSMC Singapore
( 1 ° 22 ′ 58 ″  N , 103 ° 56 ′ 5.7 ″  E )
200 mm movement Systems on Silicon Manufacturing Cooperation , founded in 1998 as a joint venture between TSMC, Philips Semiconductors (now NXP Semiconductors ) and EDB Investments from Singapore . TSMC increased its stake in SSMC to 38.8% in November 2006.
Fab 2 Hsinchu
( 24 ° 46 ′ 25 ″  N , 120 ° 59 ′ 55 ″  E )
150 mm movement


Advanced Backend Fab1 Hsinchu
( 24 ° 46 ′ 39.6 ″  N , 120 ° 59 ′ 28.9 ″  E )
Backend k. A.
Advanced backend Fab2 Shanhua, Tainan
( 23 ° 6 ′ 46.2 ″  N , 120 ° 16 ′ 26.9 ″  E )
Backend k. A.
Advanced backend Fab3 Longtan (Taoyuan)
( 24 ° 53 ′ 0.7 ″  N , 121 ° 11 ′ 11.3 ″  E )
Backend k. A.
Advanced backend Fab5 Taichung
( 24 ° 13 ′ 5.1 ″  N , 120 ° 37 ′ 11.7 ″  E )
Backend k. A.

technology

Prior art has since 2008, the production of chips with a structure size of 40 nanometers (in the 40-nm process ) by the 193 nm immersion lithography , strained silicon and the low-k dielectric - semiconductor technology . The first products in the 40 nm process included Altera's hardcopy ASICs , the RV740 GPU from AMD and the 40 nm Stratix IV FPGA family of chips.

Risk manufacturing in the 28 nm process started in the 3rd quarter of 2010 ; mass production should begin in the 4th quarter of 2010.

Since 2014 TSMC also offer chips at 16-nm - FinFET to process.

In March 2017, 10 nm FinFET production for Apple started.

The 7 nm FinFET production has been running since April 2018 and the 5 nm FinFET production since April 2020, with EUV lithography being introduced in the production of a 7 nm FinFET variant in 2019 . The 3-nm FinFET process is under development and production is expected to start in 2022.

Web links

Commons : TSMC  - collection of pictures, videos and audio files

Individual evidence

  1. a b TSMC: Annual Report 2016. (PDF) Retrieved on October 11, 2016 (English).
  2. A 7.300% Return for The Godfather Is Quite a Legacy . Bloomberg. Retrieved November 24, 2018.
  3. Corporate Executives . TSMC. Retrieved June 20, 2018.
  4. ↑ Exchange rates (as of October 2016)
  5. Fab Locations. Taiwan Semiconductor Manufacturing Company Limited, accessed March 31, 2019 .
  6. NXP Semiconductors Raises Stake in SSMC to More Than 60 Percent. November 15, 2006, accessed April 10, 2019 .
  7. TSMC to begin 28 nm production in Q3 2010 ( Memento from January 23, 2010 in the Internet Archive )
  8. Richard Goering: 2014 TSMC Technology Symposium: Full Speed ​​Ahead for 16 nm FinFET Plus, 10 nm, and 7 nm. April 28, 2014, accessed on September 22, 2014 .
  9. Jan-Frederik Timm: Apple A11: TSMC starts series production of the 10 nm iPhone SoC . In: ComputerBase . ( computerbase.de [accessed on February 9, 2018]).
  10. Marc Sauter: 7 nm makes up one fifth of sales at TSMC. April 19, 2019, accessed August 23, 2019 .
  11. Marc Sauter: TSMC starts 5-nm risk production. April 5, 2019, accessed August 23, 2019 .
  12. ^ Anton Shilov: TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged. July 23, 2019, accessed August 23, 2019 .