HTCC
High Temperature Cofired Ceramics (high-temperature multilayer ceramics ) is sintered at 1600–1800 ° C, so it isnot directly compatiblewith thick-film technology.
Frequently used conductor track materials are tungsten and molybdenum with two to three times lower electrical conductivity than copper and aluminum . Electroplated nickel plating and gold plating are necessary after sintering in order to obtain solderable and bondable layers.
Advantages:
- high number of levels (up to 70)
- high integration rate, lines and vias around 100 µm possible
- good heat conduction.
Disadvantage:
- high sintering temperature, low conductivity of the metallization
- Problems with high frequency applications.