Zig-zag in-line package: Difference between revisions
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The '''zig-zag in-line package''' or '''ZIP''' was a short-lived packaging technology for [[integrated circuit]]s, particularly [[DRAM|dynamic RAM]] chips. It was intended as a replacement for [[Dual in-line package|dual in-line packaging]] (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic, measuring about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a [[printed circuit board]], with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by [[surface mount technology|surface-mount]] packages such as the thin small-outline packages ([[Thin small-outline package|TSOP]]s) used on single-in-line memory modules ([[SIMM]]s) and dual-in-line memory modules ([[DIMM]]s). |
The '''zig-zag in-line package''' or '''ZIP''' was a short-lived packaging technology for [[integrated circuit]]s, particularly [[DRAM|dynamic RAM]] chips. It was intended as a replacement for [[Dual in-line package|dual in-line packaging]] (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic, measuring about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a [[printed circuit board]], with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by [[surface mount technology|surface-mount]] packages such as the thin small-outline packages ([[Thin small-outline package|TSOP]]s) used on single-in-line memory modules ([[SIMM]]s) and dual-in-line memory modules ([[DIMM]]s). |
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Revision as of 08:51, 3 April 2008
The zig-zag in-line package or ZIP was a short-lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic, measuring about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs) used on single-in-line memory modules (SIMMs) and dual-in-line memory modules (DIMMs).
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ZIP chips in ZIP sockets -
ZIP chips
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