Photo foil

A photoresist that is applied in solid form to the substrate is referred to as photo film (dry film resist ) . Photo foils are used z. B. for circuit boards to structure them. The process by which the photographic films are applied to the substrate is known as lamination. In this process, the substrate is enclosed between two photographic films. It is important to ensure that the resist is flat and that no air bubbles are enclosed, as otherwise incorrect exposures could occur in these areas. This means that the incoming light z. B. is broken and exposed also the places that should not be exposed. This can lead to structural errors such as B. that the conductor track is interrupted at this point.