Pitch (electronics)
The English word pitch - in German roughly equivalent to the term grid dimension - denotes the center-to-center distance of component connections. With SMD - ICs designating pitch distance center to center of the legs or solder contacts to.
Traditional pitch values for electronic components are 100 mil (2.54 mm ) or 50 mil (1.27 mm), which can also be soldered by hand.
At distances of less than 0.5 mm one speaks of fine pitch .
In the case of printed circuit boards , too , the pitch is the center-to-center distance between two test points or component connections.
The accuracy of the circuit board structures, the solder mask, the solder paste application and the soldering process determine how fine the pitch can be without fear of soldering errors.
When testing the circuit boards, the pitch has a major influence on the test system. With a pitch of> 0.8 mm, a conventional adapter can still be used for testing. If the structures become finer (so-called HDI circuit boards ), a rigid needle adapter or a flying prober is used for contacting, for example .
Individual evidence
- ↑ https://www.kurtzersa.de/electronics-production-equipment/loetlexikon/begriff/fine-pitch.html Message from ERSA , accessed on Feb. 21, 2020