Stamped circuit board
The English term Stamped Circuit Board (SCB, German »stamped circuit board «) refers to a production technique from assembly and connection technology . This involves, for example, the substrate structure of LEDs . Similar to circuit boards , this layer structure can consist of glass fiber reinforced epoxy resin and copper . The SCB technology as such is not new. As early as 1980, Norman E. Hoffman filed a patent with the number US4403107, which concerns a process for the production of stamped circuit boards .
In the case of LED substrates , basically three variants are possible: 1. the PCB ( printed circuit board ), 2. the plastic injection molding and 3. the SCB. With the SCB technology, different material combinations can be structured and laminated in a roll-to-roll manufacturing process . Since the layers are structured separately, improved design concepts can be implemented. This makes it possible to dissipate the heat generated in the chip better or faster.
Manufacturing
Both the plastic and the metal are initially processed on separate rolls, that is, depending on the requirements, the materials are individually structured ("shaped") in the punching process and then connected to one another.
advantages
When designing or selecting substrates, the application, the module design / the substrate structure, the material and the material thickness are important.
With these parameters, it is possible with the SCB technology to implement good thermal management. Because a quick heat dissipation under the chip means a longer service life of the system. Furthermore, with the SCB technology it is possible to select material according to the respective requirement and then to optimize the design "precisely".