Construction and connection technology
Assembly and connection technology ( AVT , English packaging ) comprises, as a field of microelectronics and microsystem technology, the entirety of technologies and design tools that are required for the assembly of microelectronic components (manufactured using semiconductor technology ) in a very small space.
AVT enables microelectronic and non-electronic microcomponents to be linked to form a complete system. Originally developed as a technique for the electrical contacting of micro terminals (the bonding ) of the microchip ( The ) and their encapsulation / Gehäusung of a plurality of fields (E-art micro-joining technology, materials science), the AVT into an independent engineering discipline developed in the field of Microsystem technology. A single procedural consideration is no longer sufficient for the increasing complexity of electronic microsystems , so that a discussion with AVT increasingly requires design analytical competence in the field of ECAD design.