Direct assembly

The various techniques for integrating semiconductors , which are not built into a discrete plastic or ceramic housing, but are processed without a housing as bare dies “directly” in a flat module , are referred to as direct assembly .

While most electronic assemblies get by with discrete components (see surface-mounted device ), there is an increased need for miniaturization in some applications such as cell phones or electronic watches. Usually, a semiconductor is integrated into a solderable or glued housing and then soldered or glued to a circuit carrier (e.g. printed circuit board ). Direct assembly dispenses with the intermediate integration of the semiconductor and contacts it directly on the circuit carrier. This greatly reduces the lateral space requirement of a component, but the processing costs increase.

The term direct assembly is increasingly being replaced by the term chip-on-board technology (COB) in the electronics specialist world, which is dominated by English terms . Today the term COB is not used quite correctly for all assemblies that contain bare semiconductors, while originally it was only understood to mean assemblies with chip-and-wire technology.

The most important direct assembly techniques include wire bonding , flip chip and tape automated bonding .

literature

• Reichl, H .: Direct assembly - manual on processing unhoused ICs . Springer Verlag, Berlin, Heidelberg, 1998