Tape automated bonding
Tape Automated Bonding (TAB) is a contacting process for raw semiconductor chips ( integrated circuit ) and enables fast assembly mostly directly on the circuit board ( chip-on-board ). A polyimide film with glued-on copper conductor tracks for the connectionsserves as the carrier. The process enables a very finely structured pitch and is therefore particularly suitable for chips with a large number of connections.
The TAB was originally developed as a cost-effective alternative to wire bonding . Today TAB is widely used to connect the display driver to the LC display itself.