Direct bonded copper
Direct bonded copper , ( DBC , also Direct copper bonded , DCB ), isa structurein assembly and connection technology thatenablesa close electrical / thermal connection between electronic components and chips via copper . This is particularly important in power electronics for better heat dissipation. There are both hybrid circuits using chip and wire bonding and metal-core printed circuit boards manufactured.
On the DBC substrate, conductor track structures and contact surfaces are produced from or on the copper layer in order to solder components that are particularly well cooled, which cannot be achieved with conventional circuit boards due to the poor thermal conductivity of the substrate.
Other substrate materials
The brand name IMS ( Insulated metal substrate , Henkel AG ) denotes metal core circuit boards in which the dielectric layer consists of polymer filled with ceramic powder . The heat-dissipating plate is usually made of aluminum instead of copper (see picture).
Other substrates for particularly good heat dissipation are aluminum oxide ceramics, beryllium oxide ceramics, aluminum nitride ceramics and sapphire . Aluminum oxide ceramic disks as a base plate for semiconductor components or hybrid circuits are often mounted on heat sinks without a metal plate.
Ceramic substrates are only conditionally suitable for prototypes because of their more complicated production.
literature
- Michael Pecht: Handbook of Electronic Package Design . CRC Press, 1991, ISBN 0-8247-7921-5 , pp. 145 ff .
Individual evidence
- ↑ User guidelines for IMS. (PDF) In: bergquistcompany.com. Retrieved May 24, 2018 .