Lead frame

A lead frame is a flat structure created by punching .

A common application is the creation of a system of electrical conductors in just one production step, made from a metal strip. The product then resembles a printed circuit board as found in mass electronic goods. In further refinement steps, the lead frame can be coated with plastic or the surface can be electroplated.

For higher quantities and more complex applications, single-layer, three-dimensional punched grids are first created on linked punching and bending machines from endless metal strips. By stacking these single-layer leadframes, a multi-layer leadframe package is created. This requires intermediate layers made of an insulator, which also serves as a mechanical carrier for the individual layers. If necessary, individual trains of this network can be individually punched free in a subsequent operation.

Applications for lead frame packages are found in areas where high electrical currents have to be distributed in a confined space. Such power distributors come u. A. used in automobiles. Punched grids are often designed in such a way that a direct connection to a cable set is possible via multi-pin connectors. Discrete components such as relays or fuses can be mounted on a lead frame package by introducing suitable connectors.