Zig-zag in-line package: Difference between revisions
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{{short description|Type of integrated circuit packaging}} |
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| ⚫ | The '''zig-zag in-line package''' |
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| ⚫ | The '''zig-zag in-line package''' ('''ZIP''') is a packaging technology for [[integrated circuit]]s. It was intended as a replacement for [[Dual in-line package|dual in-line packaging]] (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a [[printed circuit board]], with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by [[surface mount technology|surface-mount]] packages such as the thin small-outline packages ([[Thin small-outline package|TSOP]]s), but are still in use. The [[quad in-line package]] uses a similar staggered [[semiconductor package]] design. |
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High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a [[heatsink]]). These zig-zag packages include variations on the [[TO220]] such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in [[multi-leaded power package]]s like TDA2002/2003/2020/2030 and L200.<ref name="L2003 datasheet">http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/CD00000053.pdf {{Dead link|date=February 2022}}</ref> |
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<gallery> |
<gallery> |
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Image:zip_chip.jpg|ZIP chips |
Image:zip_chip.jpg|ZIP chips |
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</gallery> |
</gallery> |
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As for computers, [[DRAM|dynamic RAM]] ZIP chips are now only to be found in obsolete computers, some of these are: |
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* [[Amiga 500]] expansion packs |
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* [[Amiga 3000]] on-board memory and some expansion boards |
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* [[Commodore CDTV]] on-board memory |
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* [[Acorn Archimedes]] 300 and 400 series on-board memory |
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* Acorn Archimedes A3010 and A3020 |
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==See also== |
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* [[Chip carrier#Types of chip carriers|Types of chip carriers]] – list of chip package types |
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== References == |
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{{Reflist}}<!--added above categories/infobox footers by script-assisted edit--> |
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{{Semiconductor packages}} |
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{{DEFAULTSORT:Zig-Zag In-Line Package}} |
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[[Category:Chip carriers]] |
[[Category:Chip carriers]] |
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{{compu-hardware-stub}} |
{{compu-hardware-stub}} |
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Latest revision as of 19:57, 24 April 2023
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP). A ZIP is an integrated circuit encapsulated in a slab of plastic with 16, 20, 28 or 40 pins, measuring (for the ZIP-20 package) about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs), but are still in use. The quad in-line package uses a similar staggered semiconductor package design.
High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a heatsink). These zig-zag packages include variations on the TO220 such as "TO220S", "staggered leads TO-220-11", "staggered leads TO-220-15", and HZIP. The trademarks Pentawatt or Hexawatt are also used for chips in multi-leaded power packages like TDA2002/2003/2020/2030 and L200.[1]
-
ZIP chips in ZIP sockets -
ZIP chips
As for computers, dynamic RAM ZIP chips are now only to be found in obsolete computers, some of these are:
- Amiga 500 expansion packs
- Amiga 3000 on-board memory and some expansion boards
- Commodore CDTV on-board memory
- Acorn Archimedes 300 and 400 series on-board memory
- Acorn Archimedes A3010 and A3020
See also[edit]
- Types of chip carriers – list of chip package types
References[edit]
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