Thin Small Outline Package
Thin small-outline packages , or TSOPs , are a type of surface mount (SMD) chip package for integrated circuits . A special feature of this housing shape is the low height (approx. 1 mm) and the pin spacing of 0.5 mm for some types.
to form
TSOP are rectangular plastic housings which have the electrical connections (pins) only on two sides. A distinction is made between two types: Type I has the electrical connection pins on the two shorter housing sides, Type II on the two longer housing sides.
designation | Number of pins | Width in mm | length in mm | Pin spacing in mm |
---|---|---|---|---|
TSOP28 | 28 | 8.1 | 11.8 | 0.55 |
TSOP28 / 32 | 28/32 | 8th | 18.4 | 0.5 |
TSOP40 | 40 | 10 | 18.4 | 0.5 |
TSOP48 | 48 | 12 | 18.4 | 0.5 |
TSOP56 | 56 | 14th | 18.4 | 0.5 |
designation | Number of pins | Width in mm | length in mm | Pin spacing in mm |
---|---|---|---|---|
TSOP20 / 24/26 | 20/24/26 | 7.6 | 17.14 | 1.27 |
TSOP24 / 28 | 24/28 | 10.16 | 18.41 | 1.27 |
TSOP32 | 32 | 10.16 | 20.95 | 1.27 |
TSOP40 / 44 | 40/44 | 10.16 | 18.42 | 0.8 |
TSOP50 | 50 | 10.16 | 20.95 | 0.8 |
TSOP54 | 54 | 10.16 | 22.22 | 0.8 |
TSOP66 | 66 | 10.16 | 22.22 | 0.65 |
Individual evidence
- ↑ TSOP - Thin Small Outline Package , requested on February 4, 2012, engl.