Thin Small Outline Package

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Type I TSOP with 32 pins
TSOP32 Type I of the Atmel AT29C010A

Thin small-outline packages , or TSOPs , are a type of surface mount (SMD) chip package for integrated circuits . A special feature of this housing shape is the low height (approx. 1 mm) and the pin spacing of 0.5 mm for some types.

to form

TSOP are rectangular plastic housings which have the electrical connections (pins) only on two sides. A distinction is made between two types: Type I has the electrical connection pins on the two shorter housing sides, Type II on the two longer housing sides.

Type I.
designation Number of pins Width in mm length in mm Pin spacing in mm
TSOP28 28 8.1 11.8 0.55
TSOP28 / 32 28/32 8th 18.4 0.5
TSOP40 40 10 18.4 0.5
TSOP48 48 12 18.4 0.5
TSOP56 56 14th 18.4 0.5
Type II
designation Number of pins Width in mm length in mm Pin spacing in mm
TSOP20 / 24/26 20/24/26 7.6 17.14 1.27
TSOP24 / 28 24/28 10.16 18.41 1.27
TSOP32 32 10.16 20.95 1.27
TSOP40 / 44 40/44 10.16 18.42 0.8
TSOP50 50 10.16 20.95 0.8
TSOP54 54 10.16 22.22 0.8
TSOP66 66 10.16 22.22 0.65

Individual evidence

  1. ↑ TSOP - Thin Small Outline Package , requested on February 4, 2012, engl.