Viscom AG
| Viscom AG
|
|
|---|---|
 |
|
| legal form | Corporation |
| ISIN | DE0007846867 |
| founding | 1984 |
| Seat |
Hanover , Germany
|
| management |
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| Number of employees | 485 |
| sales | 88.556 million euros (2019) |
| Branch | mechanical engineering |
| Website | www.viscom.de |
| As of December 31, 2019 | |
The Viscom AG is a German manufacturer of testing equipment, especially for the automated optical inspection (AOI) and X-ray inspection , based in Hannover . The test technology is used in automotive electronics, aerospace technology, industrial electronics and the semiconductor industry.
history
Viscom was founded in 1984 by Dr. Martin Heuser and Volker Pape founded and developed software for image processing. After moving to today's headquarters in Hanover-Badenstedt in 1992, the series production of inspection systems for electronics manufacturing began. In 1995, another mainstay was established with the microfocus X-ray inspection and the world's first system that combines incident light and X-ray inspection. In 1998 the branches in the USA and Singapore were founded and a worldwide network of representatives was set up. In 2001, another business area was opened up with microsystem inspection. In the same year took place the conversion to the AG before the Viscom in May 2006 went Exchange . Since August 2007, Viscom has also been offering systems for semiconductor inspection.
Group structure
Viscom AG has the following subsidiaries:
- Viscom Inc., Atlanta, USA
- Viscom Machine Vision Pte Ltd., Singapore
- Viscom Machine Vision Trading Co. Ltd., Shanghai, China
- Viscom France SARL, Paris, France
- Viscom Tunisie SARL, Tunis, Tunisia
In addition, Viscom is present worldwide with application centers and service support points.
Products
The Viscom product range comprises four areas:
- Optical and X-ray series inspection systems for solder paste inspection, assembly control, solder joint inspection and 3D X-ray inspection.
- Special X-ray testing systems for non-destructive material testing (NDT inspection) and 3D microfocus computed tomography (µCT).
- Optical special inspection systems for bare board inspection, wire bond inspection, protective lacquer inspection and customer-specific inspection solutions.
- Semiconductor inspection systems for the inspection of MEMS , the FlipChip inspection to the bare wafer 3D check.
Web links
Individual evidence
- ↑ a b Annual Report 2019 (PDF; 1.4 MB)
Coordinates: 52 ° 21 ′ 3 " N , 9 ° 39 ′ 26" E