Dispenser technology
Dispenser technology is used in the manufacture of electronic and microsystem components for assembly and connection technology, especially for miniaturized optical or mechanical (not just electronic) systems. The technology will u. a. used in SMD technology .
With dispensers , glue , solder (mostly solder paste ) or other materials required for the connection are applied in a defined thickness and, if necessary, in a structure - mostly on the workpiece to be assembled. There are also inverse techniques in which e.g. B. adhesive is first applied by a doctor blade as a layer on an intermediate carrier and then the component to be fixed is immersed there for the adhesive transfer. The component wetted in this way is then placed on the workpiece to which it is to be connected.
The dispenser technology is used u. a. at the
- The bonding
- Flip-chip processes
- Gluing of microlenses on camera modules
- Multi-chip module
- Applying conductive varnish
Footnotes
- ^ Information from a Fraunhofer Institute on AVT , accessed on April 12, 2016
- ↑ Information from a Fraunhofer Institute on micro-production , accessed on April 12, 2016
- ^ Information from the CiS Research Institute , accessed on April 12, 2016
- ↑ Patent DE10145396 : Method and device for applying fluid substances. Published on October 21, 2010 .