PCB assembly

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Hand soldering of cables and circuit board connectors

The printed circuit board assembly is a part of electronic manufacturing services and mostly comprises setting and soldering of various electronic components on a blank, unpopulated printed circuit board (Rohplatine) by specific setting and soldering .

history

The PCB assembly won from the 1950s and 1960s in the Production Line of radio and television equipment in mass production in importance. Many production steps were already automated. However, the actual assembly of the circuit boards was done by hand. The connecting wires of the components were inserted through holes previously drilled in the circuit boards and soldered. This manufacturing process is called PTH assembly (English pin through hole ) or THT assembly (English Through Hole Technology ). Nowadays, however, the majority associate the term printed circuit board assembly with (fully) automated SMT assembly (English surface mounted technology ). This was only made possible from the end of the 1980s through technological progress and the emergence of computer-aided assembly techniques.

Workflow / procedure

SMT assembly and SMD soldering with the help of a fully automatic SMD assembly line

In principle, two different methods can be distinguished: SMT assembly and THT assembly. With THT assembly, wired components are inserted through the openings in the circuit board. This can be done manually or by machine. In the next step, the circuit board is soldered either by hand or by machine. For machine soldering, either a selective soldering system or a wave soldering system is used.

With today's SMT assembly, the first step is to apply the solder paste to the relevant points in a printing process using a special template. The components are then fitted either by hand or by machine and then soldered. Soldering can be done in a vapor phase or in a reflow oven . In the old process, the components were also fixed on the circuit board using SMD assembly adhesive and then soldered in the wave soldering system.

A review of the individual process steps may be by means of SPI ( English Solder Paste Inspection ), AOI ( English Automatic optical inspection or else AXI () English Automatic X-Ray Inspection done).

This is followed by depaneling using a depaneling device and, if necessary, a protective coating.

literature

  • Volker Wittke: The discontinuous development of the German electrical industry from the beginnings of "large industry" to the development of Fordism (1880–1975). In: How did industrial mass production come about? Edition Sigma, 1966, p. 153.
  • Klaus Feldmann: Design, Concepts, Strategies In: Assembly in power electronics for global markets. Springer, Berlin 2009. ISBN 978-3-540-87970-1 , p. 103.

Individual evidence

  1. ^ Hans-Otto Günther, Horst Tempelmeier: Production And Logistics. 6th edition, Springer, Berlin / Heidelberg / New York 2005, ISBN 3-540-23246-X , p. 24.
  2. Volker Wittke: The discontinuous development of the German electrical industry from the beginnings of "large industry" to the development of Fordism (1880–1975). In: How did industrial mass production come about? , Edition Sigma , 1966, p. 153.
  3. ^ Boy Lüthje : Location Silicon Valley: Economy and politics of networked mass production. Campus , Frankfurt am Main 2001, ISBN 3-593-36748-3 , p. 106.