|Seat||St. Florian am Inn|
|management||Erich Thallner (President)|
|Number of employees||739 (2017)|
|sales||134.1 million euros (2017)|
EV Group ( EVG - originally Electronic Visions Group ) is a manufacturer of process systems for the semiconductor industry , microsystem technology and nanotechnology . The products include manual and fully automated photolithography systems , wafer bonders and inspection systems that can be used for research and development as well as for industrial mass production. The product and process development as well as the entire production are centralized at the company's headquarters in St. Florian am Inn (Upper Austria). EVG has offices in the USA, Japan, Korea, Taiwan and China. The company has a total of around 750 employees.
The company was founded in 1980 by Erich Thallner, now President of the company, and Aya Maria Thallner under the name Electronic Visions Co. as an engineering partner for the semiconductor industry. The corporate headquarters were subsequently expanded in several steps. Parallel to the expansion of the corporate headquarters, global market development took place through the establishment of subsidiaries in the triad markets of Europe, USA and Asia. In 2011, the production capacities were expanded by more than doubling the production area through an extension. In addition, the clean rooms and application laboratories were expanded to four times their size. In 2012, EVG won the Gold Pegasus business award from OÖNachrichten in the leading company category. In the same year, EVG was also awarded the regional broadcasting prize from the BezirksRundschau. Since 2013 the company has had its own kindergarten and EVG Minis in-house childcare. EY named the managing directors of EV Group as “Entrepreneur of the Year 2014”.
The technology and product development of EVG includes the world's first double-sided mask aligner with underside microscopes , which was developed in 1985 and contributed to the commercialization of MEMS products (MEMS = Micro-Electro-Mechanical Systems). In 1990 a process was separated into wafer adjustment - i.e. the alignment of the wafers - and the actual wafer bonding, with which several silicon wafers and the electronic circuits built on them are connected to form a functional unit. The introduction of the first automatic wafer bonding system for large-scale production of MEMS in 1992 laid the foundation for activities in the wafer bonders market.
In 1994 EVG installed the first SOI production bonder (SOI = Silicon on Insulator ) for the mass production of multi-layer silicon-insulator-silicon wafers as the basis for high-end microprocessors and received the Austrian State Prize for Innovation in 2004. The patented SmartView system for wafer alignment developed in 1999 is trend-setting for 3D applications.
In 2001 EVG developed the first systems for temporary bonding and debonding as a key technology for the 3D integration of wafers with through-silicon-via technology . The world's first fully automated wafer bonding system for 300mm wafers, which paved the way for the commercialization of 3D integration, was introduced in 2002.
EVG's UV-NIL (nano-embossed lithography) systems of the latest generation presented in 2009 and the first fully automatic fusion bonding system with optical wafer alignment allowed the industry to break new ground in the manufacture of wafer-level cameras.
In 2010, the EV Group launched the first fully automatic wafer bonding system for the production of HB LEDs, which was named Innovation of the Year 2010 by the Austrian magazine "Factory". In 2011 EVG developed the industry's first wafer bonding system for wafer sizes of 450 mm. Furthermore, the new XT Frame system platforms with a higher throughput and degree of automation will be launched on the market, on the basis of which new systems for temporary wafer bonding and debonding for large-scale production were presented in 2012. Also in 2012, EVG presented a new, modular generation of its automatic systems for spin or spray coating and the development of photoresists for lithography processes in semiconductor and MEMS production. The EVG720 Automated UV NIL System, in combination with EVG's know-how, helped the innovative UV-NIL technology for the high-volume production of micro- and nanostructures to break through in 2013. In 2014, EVG introduced the industry's first high-volume production coating system and a new generation of the Fusion Wafer Bonding platform that removes important barriers to high-volume production of 3D ICs with TSVs. In 2014 EVG also announced a high vacuum wafer bonding system that enables electrically conductive and oxide-free, covalent bonds at room temperature.
Membership in industry organizations and technology consortia
- IVAM Association for Microtechnology
- MEMS Industry Group
- Austrian Society for Microsystem Technology
- Optical Society of America
- Semiconductor Equipment and Materials International
- EPIC European Photonics Industry Consortium
- The big mechanical engineering ranking 2018
- EV Group on course for strong growth , EVG press release, accessed on December 22, 2011
- Haas: Gestatten, Weltmeister ... In: OÖN Journal November 2010, pp. 10–15
- Wafer-Stars double production In: nachrichten.at, accessed on December 22, 2011
- : The EV Group is expanding In: nachrichten.at, accessed on November 5, 2012
- iPhone works with technology from EVG In: www.nachrichten.at, accessed on September 3, 2012
- EV Group wins regional award from the BezirksRundschau ( Memento of the original from November 8, 2012 in the Internet Archive ) Info: The archive link was automatically inserted and not yet checked. Please check the original and archive link according to the instructions and then remove this notice. In: BezirksRundschau.at, accessed on November 5, 2012
- EVG Minis play alongside big ones In: BezirksRundschau.at, accessed on December 29, 2014
- Entrepreneur Of The Year In: EY, accessed December 29, 2014
- EV Group E. Thallner wins State Prize for Innovation, pressetext austria , accessed on December 22, 2011
- Shining example - Innovation of the year 2010 ( Memento of the original from December 29, 2014 in the Internet Archive ) Info: The archive link was automatically inserted and not yet checked. Please check the original and archive link according to the instructions and then remove this notice. In: Factory.at, accessed on December 22, 2011
- EVG Clears Key Barriers to 3D IC TSV HVM with Fusion Wafer Bonding Solution ( Memento of the original from December 29, 2014 in the Internet Archive ) Info: The archive link was automatically inserted and not yet checked. Please check the original and archive link according to the instructions and then remove this notice. In: Solid State Technology, accessed December 29, 2014