Exobasidium kunmingense
Exobasidium kunmingense | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
Systematics | ||||||||||||
|
||||||||||||
Scientific name | ||||||||||||
Exobasidium kunmingense | ||||||||||||
Li & Guo |
Exobasidium kunmingense is a mushroom art family of Nacktbasidienverwandten (Exobasidiaceae) from the order Ustilaginomycotina . It is an endoparasite of Lyonia ovalifolia . Symptoms of infestation by the fungus are bright spots on the leaves of the host plant and protruding mycelium on the underside of the leaves. The range of the species is in China .
features
Macroscopic features
Exobasidium kunmingense is initially invisible to the naked eye. Symptoms of the infestation are hypertrophic , bright spots on the leaves. In the late stages of the infestation, the mycelium emerges as a white felt carpet on the underside of the leaves.
Microscopic features
As with all naked basidia , the mycelium of Exobasidium kunmingense grows intercellularly and forms suction threads that grow into the host's storage tissue. The fungus has a monomitic hypha structure made up of purely generative hyphae without buckles . The three- to six-pore, 4-6 µm wide basidia are simply septate at the base. They grow directly from the host epidermis . The spores are hyaline , thin-walled and 12–17 × 3–4 µm in size. When ripe they have one septum , rarely three. Conidia are absent.
distribution
The known distribution area of Exobasidum kunmingense only includes the Chinese type locality near Zhelaocun in Luquan .
ecology
The host plant of Exobasidium kunmingense is Lyonia ovalifolia . The fungus feeds on the nutrients present in the storage tissue of the plants, its basidia later break through the leaf surface and release spores. After falling on a suitable substrate, these germinate into germ tubes , from which new mycelium then develops. The species was found at an altitude of around 2500 m.
swell
- Zhenying Li, Lin Guo: Three new species of Exobasidium (Exobasidiales) from China . In: Mycotaxon . 107, 2009, pp. 215-220.