Organic Solderability Preservative

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Organic Solderability Preservative (OSP, German  organic surface protection ) is a process used in assembly and connection technology to protect the bare metal copper surfaces such as soldered connections on printed circuit boards between the production of the printed circuit boards and up to the soldering process . This layer consists of organic substances such as benzotriazole , imidazole or benzimidazole, which form an organometallic coordinative bond with the top copper layerand thus protect the copper from oxidation. Unpopulated circuit boards can be stored for several months.

Since the introduction of RoHS OSP is becoming increasingly important as cost protective coatings such as HAL lead-based are. Particularly smooth coatings can also be achieved with OSP, which is not possible with HAL. A disadvantage is the low heat resistance of OSP coatings and the consequent inapplicability for multiple assemblies. Longer storage is also not possible due to the possible formation of holes.

literature

  • I. Artaki, U. Ray, HM Gordon, RL Opila: Corrosion Protection of Copper Using Organic Solderability Preservatives. In: Circuit World. Vol. 19, No. 3, 1993, ISSN  0305-6120 , pp. 40-45, doi : 10.1108 / eb046211 .
  • Zofia Morawska, Grazyna Kozioł: Lead-Free Solderability Preservative Coatings of PCBs. In: Advancing Microelectronics. Vol. 28, No. 3, May / June 2001, p. 9 ( HTML , accessed September 12, 2010).

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