Quad Flat Package
Quad Flat Package ( QFP ) is a widely used housing design for integrated circuits in electronics . The connections ( pins ) are located on the four sides of the flat housing. QFPs are surface-mounted components that are soldered onto printed circuit boards .
QFP generally have 32 to 200 pins arranged in a grid size ( pitch are arranged mm) 0.4 to 1. If there are fewer pins, the Small Outline Package (SOP or SOIC) is more likely to be used, in which the pins are arranged on two opposite edges. The Ball Grid Array (BGA) is often used for larger numbers of pins, in which the entire underside serves as a connection area.
A direct predecessor of the QFP was the Plastic Leaded Chip Carrier (PLCC), which uses a larger pin spacing of 1.27 mm (50 mil ) and a significantly larger housing height.
variants
Starting from the basic shape, a flat rectangular (often square) body with pins on all four sides, a variety of designs are used. These usually only differ in the number of pins, pitch, dimensions and materials used (mostly to improve the thermal properties). A significantly modified variant is the bumpered Quad Flat Package (Engl. Bumper = bumper), wherein protrusion "noses" at the four corners of the pins are designed to protect against mechanical damage, before the component is soldered.
The exact designations are manufacturer-specific.
| BQFP: | Bumpered | Quad Flat Package |
| BQFPH: | Bumpered | Quad Flat Package with Heat Spreader |
| CQFP: | Ceramic | Quad Flat Package |
| FQFP: | Fine pitch | Quad Flat Package |
| HQFP: | Heat sinked | Quad Flat Package |
| LQFP: | Low profile | Quad Flat Package |
| MQFP: | Metric | Quad Flat Package |
| PQFP: | Plastic | Quad Flat Package |
| SQFP: | Small | Quad Flat Package |
| TQFP: | Thin | Quad Flat Package |
| VQFP: | Very small | Quad Flat Package |
| VTQFP: | Very thin | Quad Flat Package |
literature
- Klaus Feldmann, Volker Schöppner, Günter Spur: Handbook Joining, Handling and Assembling , 2nd edition (November 8, 2013), p. 263, Carl Hanser Verlag, ISBN 978-3-446-42827-0 .
Individual evidence
- ↑ helmut-beyers-gmbh.de - technical terms accessed on February 21, 2014