Semiconductor process

A semiconductor process referred to in the semiconductor technology a series of processes for the manufacture of semiconductor devices and microelectronic circuits .

This often refers to the overall process sequence for the manufacture of a product in a specific circuit technology , for example the CMOS process for the manufacture of electronic circuits in CMOS circuit technology. This form of a semiconductor process is less characterized by a fixed sequence of individual processes, but is more abstract. Each manufacturer of CMOS circuits therefore has its own "CMOS process", which is specially tailored to its machine park and, if necessary, other components in the circuit. The different semiconductor processes usually only have a rough production sequence of the necessary components or component parts , such as STI areas , doping of the well areas, production of the gate dielectric , gate structuring, doping of the source and drain areas, contacting, etc.

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The term is seldom used for smaller sequences of individual processes, through the combination of which a certain function can be realized. This can include the sequence of application, exposure and development of a photoresist used for photolithographic structuring , as well as RCA cleaning , the BPSG reflow, the LOCOS , the dual damascene or the salicide process . It may be that specific process parameters such as the concentrations to be used are already specified or that it is only an abstract sequence of the basic processes and it is not further defined which coating process or materials are to be used. In addition, individual processes used in semiconductor manufacture are sometimes referred to as semiconductor processes. These are processes with which the desired function or the desired goal can be achieved with a single processing, for example the entire surface coating of a wafer , as well as cleaning or material removal processes. Examples are sputter deposition , spin coating , rinsing, ion implantation for doping or chemical-mechanical planarization .

Individual evidence

1. ↑ Thomas Giebel: Basics of CMOS technology . Springer, 2002, ISBN 3-519-00350-3 , pp. P 131 .