Herbert Reichl

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Herbert Reichl (born January 1945 in Munich ) is a German engineering scientist. He held a chair for assembly and connection technology at the Technical University of Berlin and headed the Fraunhofer Institute for Reliability and Microintegration .

Life

Herbert Reichl studied electrical engineering at the Technical University of Munich after graduating from high school . After studying and doing his doctorate with Ingolf Ruge at the Institute for Integrated Circuits at the Technical University of Munich (1974), he worked at the Fraunhofer Institute for Solid State Technology in Munich, where from 1978 he headed the department for system technology and special components. In parallel to his work, he taught at the University of Applied Sciences in Munich from 1981 , where he was significantly involved in setting up a laboratory for microelectronics .

In 1987 Reichl accepted the call to a C4 professorship at the Technical University of Berlin, where he also took over the management of the research focus “Technologies of micro-peripherals ”. Since 1993 he has also headed the newly founded Fraunhofer Institute for Reliability and Microintegration (IZM) in Berlin. Under his leadership, both institutions developed into the world's top addresses for system integration and assembly and connection technologies for microelectronics (electronic packaging) and microsystem technology. In 2010 he handed over the management of Fraunhofer IZM as well as the focus on “Microperipheral Technologies” to his successor Klaus-Dieter Lang .

With Fraunhofer IZM, Reichl succeeded in successfully establishing the first “all-German” institute on the research market: the employees in the founding departments came from both East and West German research institutions. For this achievement he received an honorary doctorate from the TU Chemnitz-Zwickau in 1995. From 1996 to 2005 he was also head of the Fraunhofer Society's Microelectronics Group, which at the time comprised nine microelectronic research institutes.

Reichl was also involved in teaching, aroused interest in his subject among students and reduced the drop-out rate. His model experiment “Project Laboratory” is still an integral part of the electrical engineering bachelor's degree.

Scientific work

Herbert Reichl is considered to be one of the founding fathers of modern " electronic packaging " / assembly and connection technology . He shaped the system understanding in microelectronics for the interaction of components, package and application. He recognized early on that the race for ever higher integration densities in semiconductor components had to be accompanied by activities aimed at building such components and connecting them to the periphery. The advancement of microelectronics at that time led to circuits with over 500 connections. In the field of telecommunications, structures had to be optimized up to over 20 GHz. The power dissipation rose to over 10 W per chip. His first work after being appointed to the chair for assembly and connection technology at the TU Berlin dealt with the development of software programs to characterize the high-frequency properties of structures in assembly and connection technology. Later the simulation techniques were extended to the areas of thermal and mechanical characterization of contact structures and multi-chip modules. Technologically, the construction of individual components, for example through the use of embedding techniques, as well as the development of technologies for the construction of multi-chip modules have been advanced.

The collaboration with working groups for fracture mechanics at the former Academy of Sciences in Chemnitz and connection technology in electronics at Humboldt University led to the establishment of Fraunhofer IZM in 1993 to intensify work to ensure electrical, mechanical and thermal reliability in microsystem technology. A novelty at that time was the integration of environmental issues into such issues.

The dissolution of the strict division of labor between component manufacturers (e.g. IC production), assembly producers (provision of substrates, e.g. printed circuit boards and their assembly), providers of electronic systems (e.g. control manufacturers) and the user industries such as B. in the automotive industry, he reacted by focusing his work on the development of new integration technologies. The classic packaging changed from the "single chip package" to the "wafer level packaging" to the system integration at board level. The integration of displays, energy supply, sensors and actuators makes it necessary to further dissolve the system boundaries and thus the cooperation of almost all companies involved in the value chain.

Awards and honors

Fonts (selection)

  • Semiconductor sensors. Principles, level of development, technologies, possible applications. (= Kontakt & Studium vol. 251), Expert-Verlag, Ehningen 1989, ISBN 3-8169-0221-9 .
  • Hybrid integration. Technology and design of thick film circuits. Hüthig Verlag, 1988, ISBN 978-3-7785-1275-3
  • Micro System Technologies '90. VDE-Verlag, Berlin 1994, ISBN 3-540-53025-8 .
  • Micro System Technologies '94. (Ed. with Anton Heuberger) VDE-Verlag, Berlin 1994, ISBN 978-3-8007-2058-3 .
  • Micro System Technologies 2001. (Ed.) VDE-Verlag, Berlin 2001, ISBN 3-8007-2601-7 .
  • Micro System Technologies 2003. (Ed.) Franzis-Verlag, Poing 2003, ISBN 3-7723-7020-9 .
  • Direct assembly. Manual for processing bare ICs. Springer Verlag, Berlin / Heidelberg / New York 1998, ISBN 978-3-540-64203-9 .
  • Electronics Goes Green 2000+. A Challenge for the Next Millennium - Proceedings Volume 1: Technical Lectures. (Ed. With Hansjörg Griese) VDE Verlag, Berlin 2000, ISBN 978-3-8007-2569-4 .
  • Electronics Goes Green 2004+. Driving Forces for Future Electronics - Proceedings Volume. (Ed. with Hansjörg Griese, Harald Pötter) VDE Verlag, Berlin 2004, ISBN 3-8167-6624-2 .

Web links

Individual evidence

  1. ↑ http://archiv.pressestelle.tu-berlin.de/pi/1995/pi165.htm
  2. ↑ Microelectronics expert Herbert Reichl turns 73. izm.fraunhofer.de. January 12, 2018. Accessed July 12, 2020.
  3. ↑ https://www.siemens.com/history/de/aktuelles/1115_4-mbit-dram.htm
  4. ↑ https://www.elektronikpraxis.vogel.de/forschungsinstitut-verendunget-professor-herbert-reichl-in-den-ruhestand-a-270627/
  5. ↑ https://www.pressestelle.tu-berlin.de/menue/tub_medien/newsportal/ausgabe/?146768=&tx_ttnews%5Bcat%5D=63&tx_ttnews%5BbackPid%5D=148315&cHash=52aeeb435ecbbc29211e28c#cat3ea8bb
  6. ↑ VµE review. 10 years of the Fraunhofer Group for Microelectronics. Königsdruck, Berlin, p. 2 ( online )
personal data
SURNAME Reichl, Herbert
BRIEF DESCRIPTION German engineering scientist and university professor
DATE OF BIRTH January 1945
PLACE OF BIRTH Munich