Fraunhofer Institute for Reliability and Microintegration

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Fraunhofer Institute for
Reliability and Microintegration
Category: research Institute
Carrier: Fraunhofer Society
Legal form of the carrier: Registered association
Seat of the wearer: Munich
Facility location: Berlin-Gesundbrunnen
Branch offices: Moritzburg (Saxony) , Cottbus
Type of research: Applied research
Subjects: Engineering
Areas of expertise: microelectronics
Basic funding: under 20%
Management: Klaus-Dieter Lang
Employee: approx. 260 employees, 9 trainees, 147 student employees
Homepage: www.izm.fraunhofer.de

The Fraunhofer Institute for Reliability and Microintegration (IZM) is an institute of the Fraunhofer Society . It is based in Berlin , and its activities are related to applied research and development in the field of microelectronics . The director of the institute, Klaus-Dieter Lang, also holds a professorship at the Technical University of Berlin in the field of Nano Interconnect Technologies.

Fraunhofer IZM is a member of the Fraunhofer Group for Microelectronics (VµE) and thus part of the Research Factory Microelectronics Germany (FMD).

history

The Fraunhofer IZM was founded in 1993 under the direction of Herbert Reichl from working groups of the research focus on microperipheral technologies at the TU Berlin , the Humboldt University and a working group from the former Institute for Mechanics of the Academy of Sciences .

After extensions in Teltow and Paderborn, institute parts were added in Munich (2000 and 2002) and Chemnitz (1993 project group, 1998 department, 2003 institute part). These working groups have developed so well under the umbrella of Fraunhofer IZM that they could gradually be transferred to independence:

  • The Fraunhofer IZM branch in Teltow became independent on January 1st, 2008 as the Fraunhofer Institute for Polymer Materials and Composites (PYCO). PYCO has been a research area of ​​the Fraunhofer Institute for Applied Polymer Research (IAP) since January 1, 2016
  • The branch in Chemnitz and the Paderborn branch were transferred to the Fraunhofer facility for electronic nanosystems ENAS on July 1, 2008 .
  • The Munich branch of the institute has been independent since July 1, 2010 and since then has been developing EMFT "Modular on Top" technologies, micro-fluidics and polytronic systems as a Fraunhofer facility for microsystems and solid-state technologies . In 2017, Fraunhofer EMFT took over the Oberpfaffenhofen Training and Analytics Center - Center for Connection Technology in Electronics (ZVE) from Fraunhofer IZM

Thanks to the good development of its core areas, Fraunhofer IZM was able to more than compensate for the departures and further increase the number of employees in the following years.

In 2019 there was the opportunity to open a branch office for high-frequency sensor systems of the IZM as part of the Innovationscampus (iCampus) Cottbus and thus the cooperation with the Brandenburg Technical University Cottbus-Senftenberg (BTU), the Institute for Innovative Microelectronics (IHP) Frankfurt / Oder, the Ferdinand Braun Institute for High Frequency Technology (FBH) Berlin and the Fraunhofer Institute for Photonic Microsystems (IPMS) Dresden in the field of high frequency technology.

Locations

There are locations in Berlin, Moritzburg near Dresden and Cottbus. The institute is based in Berlin-Gesundbrunnen .

Research priorities

The institute researches and develops application-oriented and technologically optimized electronic systems and microsystems. The following technology-oriented research focuses of Fraunhofer IZM are the basis for the transfer of research into industrial production processes:

  • Integration on wafer level
    • The “Wafer Level System Integration” department specializes in the development and application of technologies for system integration at the wafer level. This includes wafer level packaging, chip size packaging, thin film technologies as well as 3D integration using silicon vias (Through Silicon Vias). [1]
  • Integration on substrate level
    • The range of services offered by the “System Integration and Connection Technologies” department ranges from advice and process development to technological system solutions. The focus of the work is on the development of processes and materials for connection technologies on board, module and package level as well as the integration of electrical, optical and power electronic components and systems. [2]
  • Materials & Reliability
    • The "Environmental and Reliability Engineering" department supports technical developments on the way to market readiness through environmental and reliability studies from nano characterization to evaluation and optimization at the system level. [3]
  • System design
    • In the "RF & Smart Sensor Systems" department, based on the technological know-how of Fraunhofer IZM, sophisticated systems for communication (including BTLE, LoRaWAN, 5G, 6G), radar (24 GHz, 60, 77– 79 GHz, 94 GHz) and sensor applications (self-sufficient sensors for harsh environments). In addition, methods and tools for the design of technologically sophisticated, miniaturized electronic systems are developed. This is done on the basis of development-accompanying simulations of the various phenomena of electrical, magnetic and electromagnetic, but also thermal and mechanical couplings. [4] . Energy supply solutions are also implemented through intelligent energy management and energy-optimized programming, energy harvesting and micro-energy storage.

These four technology clusters cover the entire spectrum that is required for the implementation of reliable electronics and their integration into the application.

Six business areas were created to improve cooperation with industry:

  • Automotive and traffic engineering
  • Medical technology
  • Photonics
  • Industrial electronics
  • Energy conversion
  • Semiconductors & sensors

Fraunhofer IZM laboratories

The following laboratories are available to test technologies and applications under practical conditions for system reliability and functionality:

  • High frequency laboratory (THz-Lab)
  • Microelectronics laboratory (IoT lab)
  • Electromagnetic shield and absorber chamber
  • Qualification and test center for electronic assemblies (QPZ)
  • Electronics Condition Monitoring Laboratory (ECM)
  • Laboratory for load cycle tests of power semiconductors (Powerlab)
  • Thermal and Environmental Analysis Lab (TEA-Lab)
  • Laboratory for textile-integrated electronics (TexLab)
  • Process line for substrate production
  • Laboratory for mold encapsulation and panel level packaging
  • Wafer Level Packaging Line Berlin
  • 300mm process line All Silicon System Integration Dresden - ASSID

Other range of services

Fraunhofer IZM offers various training courses and hosts events, such as the Ecodesign learning factory for introducing models of sustainability and the circular economy and the Start-a-Factory for networking hardware-focused startups .

University cooperation

A number of collaborations exist with industry (contract research) and with universities ( basic research ). In summary, the most important collaborations are listed here:

  • Technische Universität Berlin : Collaboration in the form of shared use of equipment, laboratories and infrastructure as well as collaboration on research projects.
  • University of Utah : Development of Biomedical Applications, e.g. B. to give paraplegic patients new mobility by connecting nerve areas to microsystems.
  • University of Applied Sciences Berlin : Establishment of a joint research group for the development of novel and miniaturization "micromechanical, high-temperature and gas sensors as well as smart silicon-based sensor systems" (until 2018).
  • Technical University of Dresden : Cooperation between the IZM-ASSID department and the TU Dresden and other non-university research institutions in Dresden in the DRESDEN-concept science association . Among other things in the field of micro / nano electronics.
  • Brandenburg Technical University Cottbus-Senftenberg (BTU): Cooperation within the framework of the innovation campus (iCampus) in the form of cooperation on research projects.

Other projects led to the collaboration with the LCLS of Stanford University , CERN ( ATLAS , Medipix ), the Fermi National Accelerator Laboratory and the German Electron Synchrotron , as well as the University of Heidelberg to support the Human Brain Project .

Infrastructure

More than 260 scientists and technical assistants, 9 trainees and around 150 students conduct research at the two locations.

The operating budget in the 2018 financial year was 33.7 million euros, 84% of which came from contract research. The orders from German and international industrial companies amounted to 15.3 million euros, the publicly funded projects with the support of the federal government, the federal states and the EU were slightly lower at 12.6 million.

Web links

Individual evidence

  1. ^ Klaus-Dieter Lang - Fraunhofer IZM. In: izm.fraunhofer.de. December 9, 2019, accessed July 13, 2020 .
  2. ↑ History - Fraunhofer IZM. In: izm.fraunhofer.de. March 26, 2020, accessed July 13, 2020 .
  3. ↑ a b Innovation Campus - BTU Cottbus-Senftenberg. In: b-tu.de. July 13, 2020, accessed July 13, 2020 .
  4. ↑ Ecodesign learning factory. In: Fraunhofer IZM. Retrieved September 8, 2018 .
  5. ↑ Eva Baumgärtner: Hardware Startups. Networking and pitching at Fraunhofer IZM. In: Informationsdienst Wissenschaft idw-online.de. November 28, 2017. Retrieved September 8, 2018 .
  6. ↑ Cooperation: Fraunhofer IZM, together with Berlin HTW, creates a new research group “Silicon Microsensors”. In: Fraunhofer IZM. July 1, 2015, accessed November 14, 2018 .
  7. ↑ Cooperation FhG-HTW. In: Fraunhofer IZM. Retrieved November 14, 2018 .
  8. ↑ Fraunhofer IZM annual report 2016/17. Retrieved February 15, 2019 .
  9. ^ Oswin Ehrmann, Thomas Fritzsch: Applied Research in Electronic Packaging for High Energy Physics Experiments. In: Indico, European Organization for Nuclear Research CERN. Fraunhofer IZM, Technical University Berlin, accessed on June 1, 2018 (English).


Coordinates: 52 ° 32 '33.1 "  N , 13 ° 23' 4.3"  E