Vacuum brazing

The vacuum soldering or reflow soldering (reflow) under vacuum is employed in electrical soldering method for void-free soldering of surface mounted components (so-called. SMD -Bauteilen) on DBC substrates . The joining of the materials, usually made of different materials, takes place in a vacuum under reduced pressure at temperatures of up to 450 ° C (soft solders). The vacuum helps u. a. while minimizing oxidation of the two parts and the solder.

The controlled use of process gases such as B. nitrogen, forming gas and hydrogen (reduction of oxide layers) is simplified by vacuum brazing. Nitrogen enriched with formic acid can also be used to reduce the oxide layers during vacuum brazing.

Vacuum soldering is used for the power supplies of voltage converters , servomotor controls and radar systems in aviation , assemblies for power semiconductors, IGBT modules, for MOS , diode and thyristor modules, contactless relays (Solid State Relay), ignitions, electronic steering assistance, ISAD -integrated starters, alternators, diesel pump and servomotor control, air conditioning control, intelligent power switching and power control for hybrid drives in the automotive industry , frequency converters , pump control, rail drives, power supplies, drive controls and cooling technology (e.g. lasers , Peltier elements ).

literature

• Reinard J. Klein Wassink: Soft soldering in electronics . 2nd Edition. Eugen G. Leuze, Saulgau 1991, ISBN 3-87480-066-0 .
• Wolfgang Scheel (Hrsg.): Assembly technology of electronics . Verlag Technik et al., Berlin et al. 1997, ISBN 3-341-01100-5 .