Socket 1151
| Socket 1151 | |
|---|---|
|
|
| Specifications | |
| introduction | August 2015 |
| design type | LGA |
| contacts | 1151 |
| Processors | Skylake , Kaby Lake , Coffee Lake |
The 1151 base (also called LGA1151) is a processor socket for desktop processors with Skylake - Kaby Lake - and coffee Lake - microarchitecture (the 6th to 9th generation Intel Core, Pentium and Celeron processors).
The processors of the Coffee-Lake generation require motherboards with series 300 chipsets, and the circuitry of the socket has been changed so that Skylake and the original Kaby-Lake processors cannot be used there. Therefore the socket is unofficially called socket 1151v2 .
The 1151 base was introduced in July 2015 as the successor to the 1150 base . Future architectures such as Cannonlake should be based on the base.
Chipsets
100 series
| H110 | B150 | Q150 | H170 | Q170 | Z170 | |
|---|---|---|---|---|---|---|
| CPU | Core i 6th generation ( Skylake ), after update partly Core i 7th generation ( Kaby-Lake ) | |||||
| overclocking | CPU (only indirectly via BCLK) + GPU + RAM (limited) |
CPU (multiplier + BCLK) + GPU + RAM |
||||
| Memory support |
DDR4 : max. 64 GB total / 16 GB per module DDR3 (L) : max. 32 GB total / 8 GB per module |
|||||
| Maximum number of ▪ DIMM slots |
2 | 4th | ||||
| ▪ USB 2.0 / 3.0 ports | 6/4 | 6/6 | 6/8 | 4/10 | ||
| ▪ SATA 3.0 connectors | 4th | 6th | ||||
| Southbridge PCI Express configuration |
6 × 2.0 | 8 × 3.0 | 10 × 3.0 | 16 × 3.0 | 20 × 3.0 | |
| Integrated graphics output (connections / can be used simultaneously) |
3/2 | 3/3 | ||||
| SATA RAID 0/1/5/10 support | No | Yes | ||||
| Intel Active Management , Trusted Execution and vPro Technology |
No | Yes | No | |||
| Intel VT-d support | Yes | |||||
| Maximum power dissipation (TDP) | 6 W | |||||
| Manufacturing process | 22 nm | |||||
| Launch | Sep 1 2015 | Q3 / 2015 | Sep 1 2015 | Aug 5, 2015 | ||
200 series
| B250 | Q250 | H270 | Q270 | Z270 | |
|---|---|---|---|---|---|
| CPU | Core i 6th generation ( Skylake ), Core i 7th generation ( Kaby-Lake ) | ||||
| overclocking | CPU (only indirectly via BCLK) + GPU + RAM (limited) |
CPU (multiplier + BCLK) + GPU + RAM |
|||
| Memory support |
DDR4 : max. 64 GB total / 16 GB per module DDR3L : max. 32 GB total / 8 GB per module |
||||
| Maximum number of ▪ DIMM slots |
4th | ||||
| ▪ USB 2.0 / 3.0 ports | 6/6 | 6/8 | 4/10 | ||
| ▪ SATA 3.0 connectors | 6th | ||||
| Southbridge PCI Express configuration |
12 × 3.0 | 14 × 3.0 | 20 × 3.0 | 24 × 3.0 | |
| Integrated graphics output (connections / can be used simultaneously) |
3/3 | ||||
| SATA RAID 0/1/5/10 support | No | Yes | |||
| Intel Active Management , Trusted Execution and vPro Technology |
No | Yes | No | ||
| Intel VT-d support | Yes | ||||
| Maximum power dissipation (TDP) | 6 W | ||||
| Manufacturing process | 22 nm | ||||
| Launch | Q1 / 2017 | ||||
300 series
| H310 | B365 | B360 | H370 | Q370 | Z370 | Z390 | |
|---|---|---|---|---|---|---|---|
| CPU | Core i 8./9. Generation ( Coffee Lake ) | ||||||
| overclocking | CPU (only indirectly via BCLK)
+ GPU + RAM (limited) |
CPU (multiplier + BCLK) + GPU + RAM |
|||||
| Memory support | DDR4 : max. 64 GB total / 16 GB per module | ||||||
| Maximum number of ▪ DIMM slots |
2 | 4th | |||||
| ▪ USB 2.0 / 3.0 / 3.1 connections | 10/4 / - | 6/8 / - | 8/2/4 | 6/4/4 | 4/4/6 | 4/10 / - | 4/4/6 |
| ▪ SATA 3.0 connectors | 4th | 6th | |||||
| Southbridge PCI Express configuration |
6 × 2.0 | 20 × 3.0 | 12 × 3.0 | 20 × 3.0 | 24 × 3.0 | ||
| Integrated graphics output (connections / can be used simultaneously) |
3/2 | 3/3 | |||||
| SATA RAID 0/1/5/10 support | No | Yes | No | Yes | Yes | Yes | |
| Intel Active Management , Trusted Execution and vPro Technology |
No | Yes | No | ||||
| Integrated WLAN | Yes | No | Yes | No | Yes | ||
| Intel VT-d support | Yes | ||||||
| Maximum power dissipation (TDP) | 6 W | ||||||
| Manufacturing process | 14 nm | 22 nm | 14 nm | 22 nm | 14 nm | ||
| Launch | Q2 / 2018 | Q4 / 2018 | Q2 / 2018 | Q4 / 2017 | Q3 / 2018 | ||
Web links
Individual evidence
- ↑ c't issue 22 2017, page 88, article 'Hot coffee', https://www.heise.de/ct/ausgabe/2017-22-Intels-Core-i-8000-Processoren-Coffee-Lake-fuer -Desktop-PCs-3853124.html
- ↑ a b Ian Cutress: The Intel 6th Gen Skylake Review: Core i7-6700K and i5-6600K Tested . Retrieved September 18, 2015.
- ↑ Asus H170-PLUS D3 Manual . Retrieved September 18, 2015.
- ↑ Intel bids adieu to DDR3: Majority of 'Skylake-S' mainboards to use DDR4 | KitGuru . Retrieved May 25, 2015.
- ↑ GIGABYTE - Motherboard - Socket 1151 - GA-Z170-HD3 DDR3 (rev. 1.0) . Retrieved September 7, 2015.
- ↑ a b Asus Announces 10 New Motherboards Based On Latest 100-Series Intel Chipsets . Retrieved October 3, 2015.
- ↑ a b ASUS Announces H170, B150, H110 and Q170 Motherboard Series . Retrieved October 3, 2015.
- ↑ Intel® Q150 Chipset (Intel® GL82Q150 PCH) Specifications . Retrieved December 26, 2015.
- ↑ Intel Unleashes Next-Gen Enthusiast Desktop PC Platform at Gamescom . Retrieved August 5, 2015.