AMD Phenom II (Mobile)
<< AMD Phenom II | |
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Production: | 2010 to 2011 |
Producers: | |
Processor clock: | 1.6 GHz to 3.1 GHz |
HT cycle: | 1.8 GHz |
L2 cache size: | 1.5 MiB to 2 MiB (total) |
Instruction set : | x86 / AMD64 |
Microarchitecture : | K10 / AMD64 |
Base: | Socket S1G4 |
The AMD Phenom II from AMD is a multi-core processor for notebooks and a representative of the K10 generation .
Technical
Despite the model name "Phenom II", these processors are the mobile offshoot of the Athlon II known from the desktop , which in contrast to the AMD Phenom II from the desktop segment does not have an L3 cache. Only the clock rates and the TDP were lowered so that the CPU is suitable for mobile use, and the CPU chips were packed in a chip housing for the S1 socket, which is used by AMD in the mobile segment.
Models
Champlain (Propus)
- Quad-core processor
- Revision: C3
- L1 cache: per core 64 + 64 KiB (data + instructions), 2-fold associative
- L2 cache: 512 kB per core with processor clock, 16-fold associative
- MMX , Extended 3DNow! , SSE , SSE2 , SSE3 , SSE4a , AMD64 , Cool'n'Quiet 3.0, NX-Bit , AMD-V
- HyperTransport 3.0 with 1800 MHz (HT3600)
- DDR3 memory controller: Dual Channel, support up to DDR3 -1066, 45W models up to DDR3-1333
- Manufacturing technology: 45 nm ( SOI ), immersion lithography
- Power consumption ( TDP ): 25-45 watts
- Release DATE: May 2010
- The size: 169 mm²
- Number of transistors: 300 million
- Clock frequencies: 1.6-2.4 GHz
- Phenom II X4
- P920: 1.6 GHz (25W TDP)
- P940: 1.7 GHz (25W TDP)
- P960: 1.8 GHz (25W TDP)
- N930: 2.0 GHz (35W TDP)
- N950: 2.1 GHz (35W TDP)
- N970: 2.2 GHz (35W TDP)
- X920 BE: 2.3 GHz (45W TDP)
- X940 BE: 2.4 GHz (45W TDP)
- Phenom II X4
Champlain with a deactivated core (Rana)
- Tri-core processor
- Revision: C3
- L1 cache: per core 64 + 64 KiB (data + instructions), 2-fold associative
- L2 cache: 512 kB per core with processor clock, 16-fold associative
- MMX , Extended 3DNow! , SSE , SSE2 , SSE3 , SSE4a , AMD64 , Cool'n'Quiet 2.0, NX-Bit , AMD-V
- HyperTransport 3.0 with 1800 MHz (HT3600)
- DDR3 memory controller: Dual Channel, support up to DDR3 -1066
- Manufacturing technology: 45 nm ( SOI ), immersion lithography
- Power consumption ( TDP ): 25-35 watts
- Release DATE: May 2010
- The size: 169 mm²
- Number of transistors: 300 million
- Clock frequencies: 1.8-2.3 GHz
- Phenom II X3
- P820: 1.8 GHz (25W TDP)
- P840: 1.9 GHz (25W TDP)
- P860: 2.0 GHz (25W TDP)
- N830: 2.1 GHz (35W TDP)
- N850: 2.2 GHz (35W TDP)
- N870: 2.3 GHz (35W TDP)
- Phenom II X3
Caspian (Regor)
- Dual core processor
- Revision: C3
- L1 cache: per core 64 + 64 KiB (data + instructions), 2-fold associative
- L2 cache: 1024 kB per core with processor clock
- MMX , Extended 3DNow! , SSE , SSE2 , SSE3 , SSE4a , AMD64 , Cool'n'Quiet 2.0, NX-Bit , AMD-V
- HyperTransport 3.0 with 1800 MHz (HT3600)
- DDR3 memory controller: Dual Channel, support up to DDR3 -1066
- Manufacturing technology: 45 nm ( SOI ), immersion lithography
- Power consumption ( TDP ): 25-45 watts
- Release DATE: May 2010
- The size: 117.5 mm²
- Number of transistors: 234 million
- Clock frequencies: 2.8-3.1 GHz
- Phenom II X2
- P650: 2.6 GHz (25W TDP)
- N620: 2.8 GHz (35W TDP)
- N640: 2.9 GHz (35W TDP)
- N660: 3.0 GHz (35W TDP)
- X620BE: 3.1 GHz (45W TDP)
- Phenom II X2