Intel Xeon (Skylake)

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Production:	since 2015
Producer:	Intel
Processor clock:	1.9 GHz to 3.7 GHz
UPI cycle:	4.8 GT / s to 10.4 GT / s
L3 cache size:	8 MiB to 38.5 MiB
Instruction set :	x86 / Intel 64 ( AMD64 )
Microarchitecture :	Intel Skylake microarchitecture
Base: LGA1151 BGA1440 Base 3647 Base 2066 BGA2518
Names of the processor cores: Skylake Skylake-X

The Intel Xeon series based on the Intel Skylake microarchitecture is a family of 64-bit microprocessors for servers and workstations from Intel . These multi-core processors with four (E3) to 28 (SP) cores represent the successors of the Intel Broadwell microarchitecture- based Intel Xeon Broadwell processors.

The Xeons of the Skylake generation were only available in the single-socket workstation variant (called E3-v5) until June 2016. These models differ from the core CPUs of the Skylake generation mainly in that they support ECC main memory.

The NUMA server processors of the "Scalable Processor" series were released in July 2017 and differ from the E3-v5 in terms of the internal structure of the cores (including AVX-512 support), number of memory channels, sockets and other points. A modification of this server series for the desktop market with four main memory channels is the Intel Core i9-7xxx series, which, contrary to the leading “7” in the model number, does not belong to the Intel Kaby Lake micro-architecture and is also called Skylake-X becomes.

Model parameters

A variety of models exist. The main parameters are:

• The first digit of the four-digit product code indicates how many processors of this type can be used in parallel on a motherboard (number of sockets as opposed to number of cores).
• Clock frequency (goes directly into the single-task performance and determines the performance of many programs)
• Cache size (increases data throughput)
• Number of cores (increases the number of tasks that can be processed simultaneously)
• Thermal Design Power: Power loss, limits the intended use, the higher the size, the larger the cooling system and power supply must be, increases with the clock frequency, the number of cores and the size of the cache. The models with an "L" after the four-digit product code are low power versions with lower energy consumption for micro servers
• Integrated GPU: only interesting for workstations with low 3D graphics performance (see also Intel HD Graphics )

E3 models

The available Intel chipsets C236, C234 and C232 for Xeon E3-12xx v5 offer eight * SATA -6G ports and up to 20 PCI-E 3.0 lanes. The connection between the chipset and the CPU is formed by a DMI , which here in version 3.0 with 8 GT / s per lane and four lanes has a transmission rate of 4 GB / sec.

For the first time in the Xeon series, E3-15xx-v5 models for so-called "mobile workstations" (mobile computers) with the solder base BGA1440 appear.

Product Code	L3 cache	Freq.	Release	Cores	TDP	integrated GPU
E3-1280 v5	8 MB	3.7 GHz	Q4'15	04th	80 W	-
E3-1270 v5		3.6 GHz	Q4'15		80 W
E3-1240 v5		3.5 GHz	Q4'15		80 W
E3-1230 v5		3.4 GHz	Q4'15		80 W
E3-1220 v5		3.0 GHz	Q4'15		80 W
E3-1260L v5		2.9 GHz	Q4'15		45 W
E3-1240L v5		2.1 GHz	Q4'15		25 W
E3-1275 v5		3.6 GHz	Q4'15		80 W	Intel® HD Graphics P530
E3-1245 v5		3.5 GHz	Q4'15		80 W
E3-1225 v5		3.3 GHz	Q4'15		80 W
E3-1535M v5		2.9 GHz	Q3'15		45 W
E3-1505M v5		2.8 GHz	Q3'15		45 W
E3-1268L v5		2.4 GHz	Q4'15		35 W
E3-1235L v5		2.0 GHz	Q4'15		25 W
E3-1505L v5		2.0 GHz	Q4'15		25 W
E3-1585 v5		3.5 GHz	Q2'16		65 W	Intel® Iris ™ Pro Graphics P580
E3-1575M v5		3.0 GHz	Q1'16		45 W
E3-1585L v5		3.0 GHz	Q2'16		45 W
E3-1545M v5		2.9 GHz	Q1'16		45 W
E3-1515M v5		2.8 GHz	Q1'16		45 W
E3-1565L v5		2.5 GHz	Q2'16		35 W
E3-1578L v5		2.0 GHz	Q2'16		45 W
E3-1558L v5		1.9 GHz	Q2'16		45 W

Xeon Scalable Processor

Xeon Scalable Processors	bronze	Silver	gold		Platinum
	3xxx	4xxx	5xxx	6xxx	8xxx
Maximum number of cores	08th	12	14th	22nd	28
Highest frequency @ cores / power loss	1700 MHz 08C / 085 W.	2200 MHz 10C / 85W	3600 MHz 04C / 105 W	3400 MHz 06C / 115 W	3600 MHz 04C / 105 W
Max. Number of bases	2		4th		8th
Number Ultra Path Interconnect (UPI)	2			3
UPI speed	09.6 GT / s		10.4 GT / s
AVX-512	1 FMA			2 FMA
Main memory clock (DDR4)	2133 MHz	2400 MHz		2666 MHz
Max. Memory expansion per socket	768 GB			768/1536 GB
Others	No Hyper Threading			with Omni-Path

The models called Xeon Scalable Processor ( SP ), together with suitable motherboards, form Intel's so-called Purley server platform . Prior to their official release, these models were known as Skylake EP / EX processors.

Corresponding system boards were already shown at Computex 2016. Corresponding CPU appeared in summer 2017.

This server platform will probably also be able to accommodate the subsequent Xeon generation of the Cascade Lake series (socket compatibility).

Intel starts the new generation of NUMA server processors in July 2017, a new naming scheme will be introduced, the previous designations E5 and E7 no longer exist, instead "precious metal classes" platinum, gold, silver and bronze:

1. The four-digit product code correlates with the “precious metal classes” in the first digit: Platinum = 8, Gold = 6 or 5, Silver = 4, Bronze = 3
2. The second digit stands for the processor generation and is therefore always "1" for Xeon Skylake!
3. The third and fourth digits identify the variant
4. Markings with T, M and F can also follow, whereby T stands for ten years of availability, M for increased memory expansion to 1536 GB (128 GB DIMMs) per socket and F for integrated omni-path interface.

As with previous generations, there are three "die" or chip manufacturing variants:

• Extreme Core Count (XCC): Cores in a 5 × 6 arrangement, max. 28 cores, three UPI connections
• High Core Count (HCC): Cores in a 4 × 5 arrangement, max. 18 cores, two UPI connections
• Low Core Count (LCC): cores in 3 × 4 arrangement, max. ten cores, two UPI connections

The sales variants are obtained from these variants through testing and selection, defective cores if necessary. switched off.

The following are specified as the essential properties of the Purley server platform:

• Six DDR4 memory channels with ECC support and higher frequencies (DDR4-2667), the memory bandwidth increases by around 50%, the maximum memory expansion with 128 GB DIMM modules also to 768 GB or 1536 GB for the M variants .
• Due to the increased number of memory channels, a new socket is required, which is also used in the Xeon Phi : Socket 3647 , also known as P3.
• The connection between the CPUs is realized through UPI connections, presumably an extended version of QPI with 9.6 and 10.4 GT / s
• The number of PCI-E channels per CPU is increased: 48 × PCI-E 3.0
• the periphery is connected via a faster version of the direct media interface, DMI version 3
• The periphery, connected via the code-named Lewisburg PCH (Platform Controller Hub), is to contain four 10 GBit Ethernet links and 20 PCI-E 3.0 lanes (chipsets C622-C628, see platform letter)
• In contrast to the earlier Xeon architectures with ring bus, the cores are connected with bus connections in a network or mesh arrangement; the further the cores are apart, the longer the waiting times.
• The cache sizes have changed significantly compared to the Broadwell generation: While the level 2 cache has been quadrupled to 1 MB / core compared to Broadwell, only 1.375 MB level 3 cache / core are now installed (Broadwell: 2.5 MB ), part of the cache has moved from the shared area (called "Uncore") to the core area (2nd level cache).
• The processor cores support the command extension AVX-512 , but with different partial command sets than the only CPU with AVX-512, Xeon Phi x200 (this supports Intel AVX-512 Foundational Instructions (AVX-512F), Conflict Detection Instructions (AVX-512CD), Exponential and Reciprocal Instructions (AVX-512ER) and Prefetch Instructions (AVX-512PF)), Xeon SP Skylake supports AVX-512F, AVX-512CD, AVX-512PF, AVX-512BW, so there is no code compatibility between these processors go out
• Variants with integrated omni-path connections are available.

Figure: Block diagram of a Xeon SP 2 socket system.

Surname	Release	Number of cores	Max. Turbo Freq.	Base Freq.	Last level cache	TDP (W)
Xeon® Platinum 8180M Processor	Q3'17	28	3.80 GHz	2.50 GHz	38.5 MB L3	205
Xeon® Platinum 8180 Processor			3.80 GHz	2.50 GHz		205
Xeon® Platinum 8176M Processor			3.80 GHz	2.10 GHz		165
Xeon® Platinum 8176F Processor			3.80 GHz	2.10 GHz
Xeon® Platinum 8176 Processor			3.80 GHz	2.10 GHz
Xeon® Platinum 8170M Processor		26th	3.70 GHz	2.10 GHz	35.75 MB L3
Xeon® Platinum 8170 Processor			3.70 GHz	2.10 GHz
Xeon® Platinum 8168 Processor		24	3.70 GHz	2.70 GHz	33 MB L3	205
Xeon® Platinum 8164 Processor		26th	3.70 GHz	2.00 GHz	35.75 MB L3	150
Xeon® Platinum 8160T Processor		24	3.70 GHz	2.10 GHz	33 MB L3
Xeon® Platinum 8160M Processor			3.70 GHz	2.10 GHz
Xeon® Platinum 8160F Processor			3.70 GHz	2.10 GHz
Xeon® Platinum 8160 Processor			3.70 GHz	2.10 GHz
Xeon® Platinum 8158 Processor		12	3.70 GHz	3.00 GHz	24.75 MB L3
Xeon® Platinum 8156 Processor		4th	3.70 GHz	3.60 GHz	16.5 MB L3	105
Xeon® Platinum 8153 Processor		16	2.80 GHz	2.00 GHz	22 MB L3	125
Xeon® Gold 6154 Processor		18th	3.70 GHz	3.00 GHz	24.75 MB L3	200
Xeon® Gold 6152 Processor		22nd	3.70 GHz	2.10 GHz	30.25 MB L3	140
Xeon® Gold 6150 Processor		18th	3.70 GHz	2.70 GHz	24.75 MB L3	165
Xeon® Gold 6148F Processor		20th	3.70 GHz	2.40 GHz	27.5 MB L3	160
Xeon® Gold 6148 Processor			3.70 GHz	2.40 GHz
Xeon® Gold 6146 Processor		12	4.20 GHz	3.20 GHz	24.75 MB L3	165
Xeon® Gold 6144 Processor		8th	4.20 GHz	3.50 GHz	24.75 MB L3	150
Xeon® Gold 6142M Processor		16	3.70 GHz	2.60 GHz	22 MB L3	160
Xeon® Gold 6142F Processor			3.70 GHz	2.60 GHz		160
Xeon® Gold 6142 Processor			3.70 GHz	2.60 GHz		150
Xeon® Gold 6140M Processor		18th	3.70 GHz	2.30 GHz	24.75 MB L3	140
Xeon® Gold 6140 Processor			3.70 GHz	2.30 GHz		140
Xeon® Gold 6138T Processor		20th	3.70 GHz	2.00 GHz	27.5 MB L3	125
Xeon® Gold 6138F Processor			3.70 GHz	2.00 GHz		135
Xeon® Gold 6138 Processor			3.70 GHz	2.00 GHz		125
Xeon® Gold 6136 Processor		12	3.70 GHz	3.00 GHz	24.75 MB L3	150
Xeon® Gold 6134M Processor		8th	3.70 GHz	3.20 GHz	24.75 MB L3	130
Xeon® Gold 6134 Processor		8th	3.70 GHz	3.20 GHz	24.75 MB L3	130
Xeon® Gold 6132 Processor		14th	3.70 GHz	2.60 GHz	19.25 MB L3	140
Xeon® Gold 6130T Processor		16	3.70 GHz	2.10 GHz	22 MB L3	125
Xeon® Gold 6130F Processor		16	3.70 GHz	2.10 GHz	22 MB L3	135
Xeon® Gold 6130 Processor		16	3.70 GHz	2.10 GHz	22 MB L3	125
Xeon® Gold 6128 Processor		6th	3.70 GHz	3.40 GHz	19.25 MB L3	115
Xeon® Gold 6126T Processor		12	3.70 GHz	2.60 GHz	19.25 MB L3	130
Xeon® Gold 6126F Processor		12	3.70 GHz	2.60 GHz	19.25 MB L3	135
Xeon® Gold 6126 Processor		12	3.70 GHz	2.60 GHz	19.25 MB L3	130
Xeon® Gold 5122 Processor		4th	3.70 GHz	3.60 GHz	16.5 MB L3	105
Xeon® Gold 5120T Processor		14th	3.20 GHz	2.20 GHz	19.25 MB L3	105
Xeon® Gold 5120 Processor		14th	3.20 GHz	2.20 GHz	19.25 MB L3	105
Xeon® Gold 5119T Processor		14th	3.20 GHz	1.90 GHz	19.25 MB L3	85
Xeon® Gold 5118 Processor		12	3.20 GHz	2.30 GHz	16.5 MB L3	105
Xeon® Gold 5115 Processor		10	3.20 GHz	2.40 GHz	13.75 MB L3	85
Xeon® Silver 4116T Processor		12	3.00 GHz	2.10 GHz	16.5 MB L3	85
Xeon® Silver 4116 Processor		12	3.00 GHz	2.10 GHz	16.5 MB L3	85
Xeon® Silver 4114T Processor		10	3.00 GHz	2.20 GHz	14 MB L3	85
Xeon® Silver 4114 Processor		10	3.00 GHz	2.20 GHz	13.75 MB L3	85
Xeon® Silver 4112 Processor		4th	3.00 GHz	2.60 GHz	8.25 MB L3	85
Xeon® Silver 4110 Processor		8th	3.00 GHz	2.10 GHz	11 MB L3	85
Xeon® Silver 4109T Processor		8th	3.00 GHz	2.00 GHz	11 MB L3	70
Xeon® Silver 4108 Processor		8th	3.00 GHz	1.80 GHz	11 MB L3	85
Xeon® Bronze 3106 Processor		8th	1.70 GHz		11 MB L3	85
Xeon® Bronze 3104 Processor		6th	1.70 GHz		8.25 MB L3	85

Xeon W

In August 2017, Intel announced another derivative of the Scalable Processor family (after Skylake-X, alias Core-i9): Processor variants for single-socket systems with four to 18 cores without UPI connections. Like the Core i9-7xxx variants (Skylake-X), these processors have four DDR-4 main memory channels and socket 2066 , but support up to 512 GB of ECC memory. They are positioned as processors for high-performance workstations. A new chipset “C422” is being presented for these processors, which in turn is almost identical to the chipset X299 for the Core i9-7xxx processors: the main difference is a newer Intel Management Engine 11.10.

Product name	Release	Cores	Max. Turbo Freq.	Base Freq.	TDP	Cache	Remarks
W-2102	?	04th			120 W		no hyperthreading
W-2104	?						no hyperthreading
W-2123	Q3'17		3.90 GHz	3.60 GHz		08.25 MB
W-2125			4.50 GHz	4.00 GHz
W-2133		06th	3.90 GHz	3.60 GHz	140 W
W-2135			4.50 GHz	3.70 GHz
W-2145		08th	4.50 GHz	3.70 GHz		11 MB
W-2155		10	4.50 GHz	3.30 GHz		13.75 MB	up to here based on the low core count - "Die"
W-2175	?	14th	?	?		19.25 MB	from here based on the high core count - "Die"
W-2195	Q3'17	18th	4.30 GHz	2.30 GHz		24.75 MB

A Xeon W-3175-X processor will be released at the end of January 2019 . This largely corresponds to the top models from the Xeon Scalable Processors series with 28 cores. It has no UPI links and is therefore limited to 1-socket machines, but like the Scalable Processors has 6 DDR4 main memory channels and socket 3647 , which is why it does not fit on motherboards of the previous Xeon W series. In contrast to the same name as "Xeon W", it is starting a new series, the third series derived from the scalable processors. Clock frequency and TDP are higher than that of scalable processors .

The main reason for its existence is likely to be the AMD Ryzen Threadripper 2990WX processor, which it easily surpasses in performance.

Xeon D 21xx

In February 2018, Intel brings an update of the first Xeon D 15xx series, which was based on the Broadwell architecture. These models called Xeon D21xx have a (new) solder base (BGA2518) and a chipset integrated in the processor package (the performance data according to various Lewisburg variants (C62x)), but this time four DDR4 main memory channels with up to eight DIMM modules and support up to 512 GB RAM, which means that apart from the socket and chipset, these are identical in construction to the Xeon W variants and the third reuse of the Skylake Scalable processor series.

The Xeon D-21xx variants are well above the first generation in terms of their equipment and performance, which is why the classification for "micro servers" or smaller machines now called "edge servers" is questionable. The intended use is mainly limited by the expandability of the main boards and, in addition to small main boards in Flex ATX and Mini-ITX format from Supermicro, there are also larger ones in ATX format from Gigabyte at the time of publication .

Meaning of the code letters in the model names:

• I = Integrated Ethernet
• T = High Temperature up to 90 degrees Celsius
• N = Integrated Ethernet and QuickAssist

Model name	Release	Cores	Turbo Freq.	Base Freq.	L3 cache	TDP	Ethernet
Xeon® D-2191	?	18th	2.20 GHz	1.60 GHz	25 MB	86 W	-
Xeon® D-2161I	Q1'18	12	3.00 GHz	2.20 GHz	16.5 MB	90 W	4 × 10 GB
Xeon® D-2141I		8th		2.20 GHz	11 MB	65 W
Xeon® D-2187NT		16		2.00 GHz	22 MB	110 W
Xeon® D-2177NT		14th		1.90 GHz	19 MB	105 W
Xeon® D-2166NT		12		2.00 GHz	17 MB	85 W
Xeon® D-2146NT		8th		2.30 GHz	11 MB	80 W
Xeon® D-2145NT		8th		1.90 GHz	11 MB	65 W
Xeon® D-2183IT		16		2.20 GHz	22 MB	100 W
Xeon® D-2173IT		14th		1.70 GHz	19 MB	70 W
Xeon® D-2163IT		12		2.10 GHz	17 MB	75 W
Xeon® D-2143IT		8th		2.20 GHz	11 MB	65 W
Xeon® D-2142IT		8th		1.90 GHz	11 MB	65 W
Xeon® D-2123IT		4th		2.20 GHz	8 MB	60 W

Comparison of Xeon D - Xeon W - Core-X - Scalable Processors

Comparison of the directly derived processor series and the competing processor AMD Threadripper

	Intel				AMD
	Xeon SP	Xeon W	Core-X (Skylake)	Xeon D-21xx	Epyc 7000	Epyc 3000	Threadripper
base	1−8 × socket 3647	Base 2066	Base 2066	Solder base BGA2518	1−2 × SP3 (LGA4094)	SP3 (LGA4094)	TR4 (LGA4094)
Cores	4−28	4−18	6−18	4−18	8−32	4−16	8-16
Clock rate (GHz)	up to 2.7 / 3.7	up to 4.5 / 3.7	4.0 / 4.3	up to 2.3 / 3.0	up to 2.4 / 3.2	? /?	3.8 / 4.0
RAM (GByte, max.)	1536 / base, ECC	512, ECC	128, no ECC	512, ECC	2048 / base, ECC	1024	128, ???
Number RAM channels	6 × DDR4	4 × DDR4	4 × DDR4	4 × DDR4	8 × DDR4	4 × DDR4	4 × DDR4
L3 cache (MB)	8.25-38.5	8.25-24.75	8.25-24.75	8−25	32-64	8-16	32
TDP (W)	70-205	120-140	140-165	60-110	120-180	35-100	140-180
AVX	2 × AVX-512	2 × AVX-512	2 × AVX-512	1 × AVX-512			1 × AVX2
PCIe 3.0 lanes	48	44	28-44	32	128	32-64	64
Chipset	C620 series	C422	X299	C620 series			X399

It can be seen that functions of the Scalable Processor series have been removed from the Xeon W as well as the Xeon D and Skylake-X. All three derivatives can increase the number of units sold and reduce scrap, since processors that do not meet the specifications of the upper series can still be used in some cases in the derived series. Since Xeon W, Xeon D and Core-i9-7xxx are intended for single-socket systems, the UPI and OPA links are also not used, as are only four of the six DDR4 main memory channels. This enables the use of a smaller socket 2066 or BGA2518, which reduces the costs for the motherboard. The waste heat (TDP), however, remains in the order of magnitude of the scalable processors, since the same "dies" are the basis, which are operated at similar frequencies. The functions of the competing processor AMD Threadripper are directly comparable with the two derived series. Graphics units are not integrated in any of the processors.

Xeon W is more of the successor to Xeon E3-1xxx v5 and v6, as it offers more cores, more main memory and AVX-512 instructions, but requires different motherboards.

See also

• Intel Xeon
• Intel Skylake microarchitecture
• Intel HD Graphics
• Intel Core i series

Individual evidence

1. ↑ Intel C236 chipset. Retrieved February 6, 2017 . 
2. ↑ Intel C232 chipset. Retrieved February 6, 2017 . 
3. ↑ Intel Xeon Gold, Platinum: Skylake-SP for server "mid-summer". Retrieved August 1, 2017 . 
4. ↑ Volker Rißka: Cascade Lake-X: Skylake-X successor will be available at the end of 2018. December 4, 2017, accessed on May 17, 2018 . 
5. ↑ Product Brief: Intel® Xeon® Scalable Platform. Retrieved August 1, 2017 . 
6. ↑ The X86 Battle Lines Drawn With Intel's Skylake Launch. Retrieved August 1, 2017 . 
7. ↑ Skylake Xeon Platforms Spotted, Purley Makes A Quiet Splash At Computex. Retrieved February 6, 2017 . 
8. ↑ Intel Skylake Xeon V5 process lineup. Retrieved February 6, 2017 . 
9. ↑ Intel® Server Board S2600WF Family. Retrieved December 10, 2017 . 
10. ↑ Intel Xeon-W workstation processors. Retrieved December 10, 2017 . 
11. ↑ Intel Product Specifications - C422 Chipset. Retrieved December 10, 2017 . 
12. ↑ Intel® Xeon® W-3175X Processor. Accessed January 31, 2019 . 
13. ↑ Intel Xeon W-3175X: With 28 cores past Ryzen Threadripper 2000. Accessed January 31, 2019 . 
14. ↑ Xeon-D-2100-for-Edge-Server. Retrieved February 9, 2018 . 
15. ↑ Intel sharpens edge-Skylake-Xeon-D. Retrieved February 9, 2018 . 
16. ↑ Overview of Supermicro motherboards. Retrieved February 9, 2018 . 
17. ↑ Gigabyte MB51-PS0. Retrieved February 9, 2018 . 
18. ↑ Intel Xeon-W-Family. Retrieved December 10, 2017 . 
19. ↑ Intel Core X Series. Retrieved December 10, 2017 . 
20. ↑ Xeon D-2100 product letter. Retrieved February 9, 2018 . 
21. ↑ Intel C620 Series. Retrieved December 10, 2017 . 
22. ↑ Intel X299 chipset. Retrieved December 10, 2017 . 

Web links

• Intel® Xeon® Processor E3 v5 Family
• Intel® Xeon® Scalable Processors
• Intel® Xeon® W-Family
• Intel® Xeon® D-Family