Intel Core i series

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Core i family Haswell.svg
Logos of the Intel Core i family based on Haswell
Production: since 2008
Producer: Intel
Processor clock: 1.06 GHz to 5.0 GHz
L3 cache size: 3 MiB to 24.75 MiB
Manufacturing : 45, 32, 22, 14 and 10 nm
Instruction set : x86 (16 bit), x86-32, x86-64
Microarchitecture : Nehalem , Sandy Bridge , Ivy Bridge , Haswell , Broadwell , Skylake , Kaby Lake , Coffee Lake
Names of the processor cores:
  • Lynnfield, Clarksfield, Bloomfield
  • Clarkdale, Arrandale, Gulftown
  • Sandy Bridge, Sandy Bridge-M, Sandy Bridge-E
  • Ivy Bridge, Ivy Bridge-M, Ivy Bridge-E
  • Haswell, Haswell-E, ...
  • Broadwell, Broadwell-E, ...
  • Skylake, Skylake-X, ...
  • Kaby Lake, Kaby Lake-X, ...
  • Coffee Lake, ...
  • Whiskey Lake
  • Amber Lake
  • Comet Lake, ...
  • Cannon Lake
  • Ice Lake

The Core-i series of Intel is a family of medium to high-priced x86 - microprocessors for mobile and desktop computers in typical applications such as office work, Internet, multimedia, leisure and play. At the end of 2008 it replaced the Core 2 family; The current 7th generation is in the area of ​​CPUs with more than 8 cores (categories i7 and i9), the 8th generation in the area of ​​up to 8 cores (categories i3, i5 and i7) and the 9th generation in the area of ​​mobile processors. The 10th generation for i3, i5, i7 and i9 processors is newly released (as of Jan 2020).

The Core i series serves the largest market segment; Intel still offers the affordable Pentium and even cheaper Celeron processors in a price class below that, while the Xeon processors are intended for servers. Like the previous series, it supports the Intel 64 extension and all SSE extensions up to SSE4.2.


Categories (Intel Core i3-, i5-, i7-, i9-)

With the categories i3, i5, i7 and, since 2017, i9, Intel divides the processors into performance classes. The assignment does not depend on the socket used , but on various processor properties. The number of cores , Hyper-Threading support, the width of the memory connection and the support for short-term overclocking (turbo mode) play a role, but features such as Trusted Execution Technology (TXT) and parts of the cache can also be used with processors with lower Model numbers must be disabled. However, this classification is not a reliable indicator of performance. So it is quite possible that a Core i5 desktop processor calculates significantly faster than a Core i7 for notebooks.

The Core i7 processor series is initially intended for the high and maximum performance segment, which is why there is also an Extreme Edition with a free multiplier in the tradition of previous Intel series. Core i5 is positioned directly below the Core i7 . At the beginning of 2010, new dual-core processors ( i3 and partly i5 ) in 32 nm production followed, with which the older Core 2 duos were replaced. In May 2016, Intel expanded the i7 series with 6, 8 and 10-core CPUs for the desktop based on Broadwell E in 14 nm production for the desktop, which are not aimed exclusively at the high-performance segment.

Before the appearance of a new microarchitecture, Xeon processors are sometimes sold as i-Core family members, which are then usually referred to as Core i7 variants or Extreme Editions . They typically have more than 4 processor cores, the server processor socket, 4 main memory channels and have no integrated processor graphics; for these reasons, they also require special motherboards. Code names for these processor series were: Sandy Bridge E, Ivy Bridge E, Haswell E, Broadwell E and, most recently, Skylake X.

In May 2017, Intel announced the Core i9 platform for the third quarter of 2017, the top model of which, the Core i9-7980XE, has 18 cores. These are modifications of the Xeon Scalable Processors with Skylake-X cores, which use the 2066 socket with DDR4 main memory channels. The first CPUs with the processor core called Coffee Lake have been available since October 2017, for which mainboards must be equipped with the chipset of the 300 series.

Technically, the Intel Core i series still includes the Intel Pentium G and Intel Celeron G processors , which have been slimmed down, but are based on the same architecture in contrast to the J and N series .

Model numbers (3, 4, or 5 digits)

Line of Core i processors
Node architecture Development step Gene. Processors Release Cores R.A.M. base Structure of the
model number
45 nm  Nehalem Nehalem 01 Lynnfield Aug. 09 04th 2 Socket 1156 007 xx or  8 xx i7-860
Bloomfield Nov. 08 04th 3 Socket 1366 009 xx i7-920
32 nm  Westmere Clarkdale Apr. 10 02 2 Socket 1156 005 xx or  6 xx i5-680
Gulftown Jul 10 06th 3 Socket 1366 009 xx i7-970
Sandy Bridge Sandy Bridge 02 Sandy Bridge Jan. 11 2-4 2 Socket 1155 02 xxx i7 2 600
Sandy Bridge-E Nov. 11 4-6 4th Base 2011 03 xxx i7-3930K
22 nm  Ivy Bridge 03 Ivy Bridge Apr. 12 2-4 2 Socket 1155 03 xxx i7 3 770
Ivy Bridge-E Sep 13 4-6 4th Base 2011 04 xxx i7-4930K
Haswell Haswell 04th Haswell Jun. 13 2-4 2 Socket 1150 04 xxx i7 4 770
Haswell-E Aug. 14 6-8 4th Base 2011-3 05 xxx i7-5930K
14 nm  Broadwell 05 Broadwell Jun. 15 2-4 2 Socket 1150 05 xxx i7 5 775C
Broadwell-E May 16 6-10 4th Base 2011-3 06 xxx i7-6950X
Skylake Skylake 06th Skylake Aug. 15 2-4 2 Socket 1151 06 xxx i7- 6 700K
Skylake-X May 17 6-18 4th Base 2066 07 xxx i7-7820X
Kaby Lake 07th Kaby Lake Aug 16 2-4 2 Socket 1151 07 xxx i7 7 700K
Kaby Lake-X Jun. 17 04th 2 Base 2066 i7 7 740X
Coffee Lake 08th Coffee Lake Aug. 17 4-6 2 Socket 1151 08 xxx i7- 8 700K
Coffee Lake-S Oct. 18 6-8 2 09 xxx i7-9700K
Coffee Lake-X Q4 18th 8-18 4th Base 2066 09 xxx i9-9980XE
Whiskey Lake Whiskey Lake Aug. 18 2-4 2 FCBGA 1528 08 xxx i7- 8 565U
Comet Lake 0? Comet Lake-U Aug. 19 2-6 2 FCBGA 1528 10 xxx i7-10710U
Cascade Lake X 0? Cascade Lake X Q4 19th 10-18 4th Base 2066 10 xxx i9-10980X
10 nm  Cannon Lake 0? Cannon Lake after 18 02 2 BGA 1356 08 xxx i3-8121U
Ice Lake Ice Lake 0? Ice Lake Nov. 19 2-4 2 FCBGA 1528 10 xx G x i7-1065G7
Tiger Lake 0? Tiger Lake ?

The category (“i3” to “i9”) is followed by a model number, which in the first generation ( Nehalem ) consisted of three digits. From the second generation, Intel put a digit in front of the generation, so that the model number now consisted of four digits. From the 10th generation, the model number has four or five digits. The first two digits stand for the generation (micro-architecture) of the processor (gen number) .

From the 7th "generation" onwards, this scheme is broken by Intel: the 10 nm manufacturing process is delayed by more than 3 years, contrary to the original planning, and Intel's development model process architecture (also called tick-tock) is no longer feasible Microarchitecture called Cannon Lake is ultimately eliminated completely. Intel is now highlighting a further development step : process - micro-architecture - optimization . In this sense, the developments called micro-architecture from Skylake to Ice-Lake (the jump to the 10 nm process) are all optimizations; the micro-architecture still largely corresponds to the Skylake micro-architecture. Nevertheless, new generation digits are assigned to Kaby Lake, Coffee Lake, Whiskey Lake and Comet Lake. In the server area ( Intel Xeon ) these microarchitectures are largely omitted, here a switch is made from Skylake to Cascade Lake. Since an Extreme series (with the ending "-X") is always reused by the server CPUs , the assignment generation - microarchitecture gets completely confused: Skylake-X, like Kaby-Lake, is run under Generation 7, Cascade-Lake- X, like Comet-Lake and Ice-Lake, is run under Generation 10. We can therefore no longer speak of a schema.

High-end desktop processor (HEDT): requires server board. The digits in front of the model number are increased by 1 compared to the generation number.
Desktop processor: but requires server board.
Desktop processor: Refresh with increased clock frequency, normal board, digits in front of the model number are increased by 1 compared to the generation number.
Mobile processor: reduced power consumption, lower performance, solder base

item number

The last two or three digits stand for the article number (Stock Keeping Unit digits) . Intel awards them according to changing rules. Number correlates with performance and even more so with price.

Suffixes (max. 2 letters)

The model number can be followed by up to two capital letters:

Letters (combinations) attached to model numbers
suffix TDP Further meaning
CPU E. An E or a combination of TE , UE , ME , LE , QE or EQ always stands for embedded .
X An X or in combination an XM , MX or XE stands for eXtreme. It is i. d. Typically Xeon processors, which were sold as particularly powerful Core-i before the release date of the successor series. Mostly they are processors of the previous generation, i. H. a 5th generation Xeon is "re-branded" into a 6th generation Core-i-Extreme.
F. An F stands for a missing graphics unit (from Core ™ i? -9xxx).
K An open-top clock multiplier
C. An upwardly open clock multiplier on the Core ™ i5-5675C and Core ™ i7-5775C.
S. An S stands for energy savings through reduced performance, mostly through later / less frequent activation of the "turbo mode" (performance-optimized, "performance-optimized lifestyle").
T A T stands for energy savings through reduced equipment, mostly equipped with fewer cores than the regular model without suffix (Energieoptimiert, "Power-Optimized Lifestyle). This variant includes the energy optimizations of the S series (later switching on of the turbo mode) .
E. <55 W An E stands for energy-efficient processors. This suffix was used in the Core Duo and is the forerunner of the S and T suffixes .
P Desktop CPUs with either a slimmed-down or without an integrated graphics unit.
H Both letters stand for high-performance graphics. R stands for desktop CPUs that are to be mounted on a notebook socket, while CPUs with H are to be installed on regular desktop sockets. H can be combined with other letters, e.g. B. HQ for a quad-core with high-performance graphics.
LM Mobile CPUs with reduced ( LM , low power mobile ) or greatly reduced ( UM , ultra low power mobile ) TDP.
As of the Core-i-2000M series, the suffixes LM and UM are no longer applicable , so that it is necessary to study the data sheet.
U <17 ... 18 W. From the Core i 3000 series notebook processors with reduced voltage. U stands for ultra low power .
Y <13 W From the Core i 3000 series notebook processors with reduced voltage. Y for extremely low power .
L. 12 ... 19 W. An L or a P stand for a particularly energy-saving processor. These letters were used in the Core Duo and are the technical precursors of the U and Y suffixes . Contradiction: i3-9100H L or i7-2655 L E have a TDP of 25 W.
P 20 ... 29 W.
M. Mobile dual cores for mobile
QM Mobile Quad-Cores for Quad-Core Mobile
MQHQHK 35 ... 45 W. Mobile quad cores, the K indicates a free multiplier.
G Processors with integrated AMD Radeon graphics unit
H Entry class for non-K processors (not overclockable)
B. Entry-level models with better features than the H chipset
Q Professional models for companies
Z Chipset for mainstream overclockable processors
X High-end chipset for overclockable high-end desktop models


Nehalem (1st generation)

With the Nehalem generation, the Front Side Bus (FSB) and the Northbridge as a system connection for memory and peripherals were bid farewell. Instead, the main memory is connected directly to the CPU and communication between the chipset and processor takes place via a point-to-point connection called QuickPath Interconnect (QPI). In addition, the CPU itself has PCI Express lanes, to which the graphics card is usually connected. Previously, these transfers were made via an additional component, the northbridge, which was thus obsolete. Simultaneous Multithreading (SMT) also appears again, which was already used in Pentium 4 processors under the name Hyper-Threading, but disappeared with the core architecture.

Further innovations include a further expansion stage of the streaming SIMD extensions, SSE4.2, and that all quad-core processors are not composed of two dies, as is the case with Yorkfield and Kentsfield, but consist of one die.

Westmere Shrink

Westmere represents the shrink on 32 nm. Furthermore, six-core processors appear for the first time in the non-server area.

Sandy Bridge (2nd generation)

Sandy Bridge

Sandy Bridge processors are available in both a quad-core version and a dual-core version with an integrated GPU . There are two versions of the dual-core version, one with the larger GPU with 12 shader units and another with a smaller GPU with only 6 shader units. This generation also has models for the desktop area that take place on the 1155 socket, and models for the mobile area that use the PGA 988B (G2), BGA 1023 and BGA 1224 sockets.

Sandy Bridge E.

The six-core models sold in the desktop segment are actually native eight-cores with two deactivated cores. These processors do not have an integrated graphics processor, but the integrated PCIe controllers offer more than twice as many lanes than is the case with the Sandy Bridge (without E). The Patsburg chipset X79 is still connected via DMI with 20 Gbit / s. Due to the additional PCIe lanes, the quad-channel memory controller, and the origin of the CPU from the server segment, where there are also QPI interfaces (which are switched off on the desktop pendant) for connecting further CPUs, the number of socket pins increases to 2011 pins on.

In February 2012, Intel also presented a quad-core offshoot for the 2011 socket. The processor design is identical to the eight-core version, with the exception of the reduced L3 cache and fewer cores and thus fewer transistors and a smaller chip area. However, the quad-core variant does not offer an open multiplier.

Ivy Bridge (3rd generation)

Ivy Bridge processors are available in both quad-core and dual-core versions. As with the Sandy Bridge, there are variants with a full expansion stage of the GPU with 16 shader units, but also those with only 6 shader units.

Haswell (4th generation)

Haswell processors are available in both quad-core and dual-core versions. All models available so far contain an integrated GPU . In contrast to the previous generation, Haswell processors use the newly developed LGA1150 socket, which means they are not compatible with the mainboards of the previous series.

Broadwell (5th generation)

Within the Broadwell generation there are again versions with and without integrated processor graphics. The fastest processor graphics HD Graphics 6000 or Iris Pro 6200 now have 48 shader units, the Iris Pro 6200 an additional 128 MB embedded DRAM on the processor package.

The sockets BGA 1168 , BGA 1364 (mobile computer) and LGA 1150 (desktop) continue to be used as with the Haswell generation, i3 / i5 / i7-5xxx have 2 DDR4 main memory channels and up to 4 cores.

The i7-68xx and i7-69xx versions are derived from the Xeon E5-v4 server processors and, like these, have the 2011-3 socket , 4 DDR4 main memory channels, 6, 8 or 10 cores (i7-6950X Extreme Edition) and no integrated processor graphics. You will Broadwell E called.

Skylake (6th generation)

Skylake generation graphics cores
Graphics core Shader 4k @ 60Hz eDRAM
HD Graphics 510 GT1 012   00- no more analog interfaces (VGA)
HD Graphics 520 GT2 024  Yes 00- eDP, DP , HDMI 1.4, DVI (three displays simultaneously)
Iris ™ Graphics 540 GT3e 048  Yes 064 MB hardly any increase in performance compared to the Iris Pro Graphics 6200
Iris ™ Pro Graphics 580 GT4e 072  Yes 128 MB Performance increase over Iris Pro Graphics 6200

In summer 2015 the first Skylake Core ™ i5 / i7 will appear.

In January 2016 the first Core ™ i7 processors of the Skylake generation with Iris Pro graphics (e.g. Core ™ i7-6970HQ) will appear

New this time is a fourth performance level of the integrated graphics, the Iris Pro Graphics 580.

The performance data of the other Core ™ i3 / i5 / i7-6xxx models are within the usual scope of the Core i processors: 2-4 cores, 2 main memory channels and a total of four different integrated processor graphics. These no longer have a VGA output, but can control up to three screens at the same time. Compared to the Broadwell generation, the processors come with new sockets: Sockets LGA 1151, BGA 1356 and new chipsets, so they need new motherboards.


In the summer of 2017, Intel announced the Skylake-X processor series. Processors with more than eight cores are assigned to the Core ™ i9 series. Several trade magazines criticized insufficient product maturity. Apparently the announcement was hasty and a reaction to the competition AMD, whose Zen Threadripper processor was released in August 2017. Skylake-X is a reused server processor from the Xeon Scalable Processor series. This also differs in the processor core from the Core ™ i3 / i5 / i7-6xxx models, because for the first time two SIMD - AVX-512 instruction set expansion units are installed. Special motherboards are again required for this series of processors, this time a different processor socket than for the server models is used, socket 2066 . Four DDR4 main memory channels, up to 128 GB working memory, but no error correction (ECC) are supported. The Skylake-X models have 6 to 18 cores (Extreme Edition) and require the X299 chipset.

The 2018 releases of the Skylake X generation are still 6th generation processors. Intel deviates from the nomenclature it has been using since 2008. The following were changed:

  • Relabelling (without architecture changes, the first digit is increased from "7" to "9", i9-9820X ​​is no longer listed as i7)
  • Better thermal interface between die and heatspreader (again soldered with indium, verified at least on the i9-9980XE)
  • Use of the high core count die also for the "small" CPUs (i9-9900X, i9-9820X, i7-9800X)
  • Use of the L3 cache of unused cores (plus 5 ½ MB: i9-9900X, i7-9800X; plus 2 ¾ MB: i9-9920X, i9-9820X)
  • Activation of all 44 PCI lanes (i9-9820X, i7-9800X)
  • Use of two additional cores (i9-9820X, i7-9800X)
  • Increase the core tension by about 12% at maximum cycle
  • Increase the TDP to 165 W for all models
model Release Cores
Tact TDP L3
base turbo
Core ™ i9-7980XE Q3 17th 18 (36) 044 2.6 GHz 4.4 GHz 165 W 24 ¾  MB up to here from the
high core count -
which arose
Core ™ i9-7960X 16 (32) 2.8 GHz 22 MB
Core ™ i9-7940X 14 (28) 3.1 GHz 19 ¼ MB
Core ™ i9-7920X 12 (24) 2.9 GHz 140 W 16 ½ MB
Core ™ i9-7900X Q2 17th 10 (20) 3.3 GHz 4.5 GHz 13 ¾ MB from here on from the
low core count - they
Core ™ i7-7820X 08 (16) 028 3.6 GHz 11 MB
Core ™ i7-7800X 06 (12) 3.5 GHz 4.0 GHz 08 ¼ MB
Core ™ i9-9990XE Jan. 19 14 (28) 044 4.0 GHz 5.0 GHz 255 W 19 ¼ MB OEM only
Core ™ i9-9980XE Q4 18th 18 (36) 044 3.0 GHz 4.5 GHz 165 W 24 ¾ MB all CPUs are
derived from the
high core count -
Core ™ i9-9960X 16 (32) 3.1 GHz 22 MB
Core ™ i9-9940X 14 (28) 3.3 GHz 19 ¼ MB
Core ™ i9-9920X 12 (24) 3.5 GHz
Core ™ i9-9900X 10 (20) 3.5 GHz
Core ™ i9-9820X 10 (20) 3.3 GHz 4.2 GHz 16 ½ MB
Core ™ i7-9800X 08 (16) 3.8 GHz 4.5 GHz

Kaby Lake (7th generation)

The Kaby Lake generation first went on sale in August 2016.

Kaby Lake-X

Two Kaby Lake processors require expensive mainboards with an LGA 2066 socket, but hardly use the advantages of these. Only two memory channels and 16 PCIe lanes are used, for which an LGA-1155 board would be sufficient. The only difference to the Kaby Lake-S processors for socket 1151 is the higher TDP. These processors were discontinued just 11 months after their market launch.

model Release Cores
Tact TDP L3
base turbo
Core ™ i7-7740X Q2 17th 04 (8) 016 4.3 GHz 4.5 GHz 112 W. 08 MB only two main
memory channels
Core ™ i5-7640X 04 (4) 4.0 GHz 4.2 GHz 06 MB

Coffee Lake (8th generation)

In early October 2017, Intel released the first Coffee Lake processors for desktop PCs. For the first time there are six-core processors in the desktop area (Core ™ i7-8700K, Core ™ i5-8600K and Core ™ i5-8400).

On April 3, 2018, more Coffee Lake processors came on the market, which were intended for the lower price segment. The Core ™ i3 category included quad-core processors for the first time. The new models include the following:

  • Celeron G4900 with 3.1 GHz and G4290 with 3.2 GHz and Pentium Gold G5400 to G5600 with 3.7 to 3.9 GHz
  • Core ™ i3-8300, Core ™ i5-8500 and Core ™ i5-8600

The following models are among the currently strongest and most important Coffee Lake CPUs:

The most important Intel Core Coffee Lake CPUs at a glance
model Release Cores
Tact TDP L3
base turbo
Core ™ i7-8086K June 18 06 (12) 016 4.0 GHz 5.0 GHz 095 W 12 MB Die size
16.6mm × 9.2mm
Core ™ i7-8700K Oct. 17 3.7 GHz 4.7 GHz 095 W
Core ™ i7-8700 Apr. 18 3.2 GHz 4.6 GHz 065 W
Core ™ i7-8700T Apr. 18 2.4 GHz 4.0 GHz 035 W
Core ™ i5-8600K Oct. 17 06 (6) 3.6 GHz 4.3 GHz 095 W 09 MB
Core ™ i5-8400 Oct. 17 2.8 GHz 4.0 GHz 065 W
Core ™ i5-8500T Apr. 18 2.1 GHz 3.5 GHz 035 W
Core ™ i3-8350K Oct. 17 04 (4) 4.0 GHz 091 W 06 MB
Core ™ i3-8100 Oct. 17 3.6 GHz 065 W

Coffee Lake Refresh (9th generation)

All of the Core i5 and i7 processors listed here have a soldered heatspreader, see cooling problems . The Core i3 category included processors with Turbo Boost for the first time. The Core ™ i7 category has more cores than the previous generation, but loses Hyper-Threading.

model Release Cores
Tact TDP L3
base turbo
Core ™ i9-9900KS Oct. 19 08 (16) 016 4.0 GHz 5.0 GHz 127 W. 16 MB only 1 year
manufacturer warranty
Core ™ i9-9900K Oct. 18 3.6 GHz 5.0 GHz 095 W Die size
19.4mm × 9.2mm
Core ™ i9-9900KF Q1 19th 3.6 GHz 5.0 GHz 095 W
Core ™ i9-9900 May 19 3.1 GHz 5.0 GHz 065 W
Core ™ i9-9900T May 19 2.1 GHz 4.4 GHz 035 W
Core ™ i7-9700K Oct. 18 08 (8) 3.6 GHz 4.9 GHz 095 W 12 MB
Core ™ i7-9700 May 19 3.0 GHz 4.7 GHz 065 W
Core ™ i7-9700T May 19 2.0 GHz 4.1 GHz 035 W
Core ™ i5-9600K Oct. 18 06 (6) 3.7 GHz 4.6 GHz 095 W 09 MB
Core ™ i5-9600 May 19 3.1 GHz 4.6 GHz 065 W
Core ™ i5-9600T May 19 2.3 GHz 3.9 GHz 035 W
Core ™ i5-9500 May 19 3.0 GHz 4.4 GHz 065 W
Core ™ i5-9500T May 19 2.2 GHz 3.7 GHz 035 W
Core ™ i5-9400 March 19 2.9 GHz 4.1 GHz 065 W
Core ™ i3-9350K March 19 04 (4) 4.0 GHz 4.6 GHz 091 W 08 MB
Core ™ i3-9100 May 19 3.6 GHz 4.2 GHz 065 W 06 MB

Whiskey Lake (8th generation)

model Release Cores
Tact TDP L3
base turbo
Core ™ i7-8565U Aug. 18 04 (8) 016 1.8 GHz 4.6 GHz 15 W
(10-25 W)
08 MB Intel UHD
Graphics 620
Core ™ i5-8265U 1.6 GHz 4.1 GHz 06 MB
Core ™ i3-8145U 02 (4) 2.1 GHz 3.9 GHz 04 MB

Comet Lake (10th generation)

Another chip generation in 14 nm that Intel has announced. More information has been on Github since January 29, 2019.

There will be three categories:

  • Comet Lake-U with 2 to 6 cores
  • Comet Lake-H with 6 to 10 cores
  • Comet Lake-S with 6 to 10 cores

The HD Graphics 520 GT2 is used as the graphics. The CPUs support AVX2, but not AVX512.

The most important Intel Core Comet Lake CPUs at a glance
model Release Cores
Tact TDP L3
base turbo
Core ™ i7-10710U Aug. 19 06 (12) 016 1.1 GHz 4.7 GHz 015 W 12 MB
Core ™ i7-10510U Aug. 19 04 (8) 1.8 GHz 4.9 GHz 08 MB
Core ™ i5-10210U Aug. 19 04 (8) 1.6 GHz 4.2 GHz 06 MB
Core ™ i3-10110U Aug. 19 02 (4) 2.1 GHz 4.1 GHz 04 MB

Cannon Lake Shrink

Launched on May 15, 2018. Economical mobile processor without graphics unit. Sample devices available since the end of December 2018, the chip never went into mass production due to manufacturing problems in the 10 nm process, and end devices with these chips were never sold. Cannon Lake is thus skipped as a 10 nm CPU architecture, the first 10 nm devices come with Ice Lake CPUs (see below).

model Release Cores
Tact TDP L3
base turbo
Core ™ i3-8121U Dec. 18 2 (4) 016 2.2 GHz 3.2 GHz 15 W 04 MB no integrated GPU, die area approx. 71 mm²

Cascade Lake (10th generation)

Like Skylake-X, this series is a re-use of the Xeon server CPUs from the Cascade Lake series with its own socket ( socket 2066 ) for 4 DDR4 main memory channels and therefore requires its own motherboard again. As with Skylake-X, the X299 is used as the chipset, so that Cascade-Lake-X is socket-compatible with Skylake-X CPUs.

model Release Cores
Tact TDP L3
base turbo
Core ™ i9-10980XE Q4 19th 18 (36) 048 3.0 GHz 4.6 GHz 165 W 24 ¾ MB
Core ™ i9-10940X 14 (28) 3.3 GHz 19 ¼ MB
Core ™ i9-10920X 12 (24) 3.5 GHz
Core ™ i9-10900X 10 (20) 3.7 GHz 4.5 GHz

Ice Lake (10th generation)

  • Launched August 1st, 2019
  • Economical mobile processor
  • System-on-a-chip, the actual CPU occupies just under 25 percent of the chip area with quad-core
  • Native support for typical notebook functions
  • Probably no more classic CPU-PCI-Express lanes, only PCI-Express lanes via the Platform Controller Hub
  • Native support for Thunderbolt 3 and USB 3.1
  • Integrated graphics and DP 1.4
  • Support of LP-DDR up to 3733 MT / s
  • Intel IPU
  • New Gaussian Neural Accelerator
model Release Cores
Tact TDP L3
base turbo
Core ™ i7-1065G7U Aug. 19 4 (8) 016 1.3 GHz 3.9 GHz 15 W 08 MB The area 122.5 mm²
4 ×  Thunderbolt 3
Core ™ i7-1060G7U 4 (8) 1.0 GHz 3.8 GHz 09 W. 08 MB
Core ™ i5-1035G7U 4 (8) 1.1 GHz 3.7 GHz 15 W 06 MB

Lakefield (10th generation)

  • Launched June 10, 2020
  • Economical mobile processor with graphics unit and RAM
  • The entire chip is 12 × 12 × 1 mm
  • Uses Intel's Foveros technology to stack chips
  • extremely small die of the CPU with 82 mm²
  • Up to 8gb LP-DDR4-4266 PoP-RAM integrated directly in the chip
  • 7 watt TDP in turbo mode max 9 watt TDP for i5 variant
  • Extremely low standby consumption with 2.5 mW standby SoC power
model Release Cores
Tact TDP L3
GPU clock GPU EU's Remarks
base turbo
Core i5-L16G7 Jun. 20 5 (5) 06th 1.4 GHz 3.0 GHz 7 W 04 MB 500 MHz 64 The area 92 mm²
Core i3-L16G4 5 (5) 0.8 GHz 2.8 GHz 07 W 04 MB 48

Cooling problems

Numerous hardware manufacturers complained that processors from the Haswell generation onwards tend to overheat under full load and get hotter than their predecessor processors at the same rate. The cause is an Intel with the introduction of the generation Ivy Bridge altered production process, after which the space between the the or the unhoused processor and the heatspreader not with indium (thermal conductivity: 82 W / K · m) soldered, but a thermal grease ( max. 12.5 W / K m) is filled. The thermal resistance increases by about 0.1 K / W. With the same power loss and cooling, the processor dies are 10 to 13 K hotter. In the case of processors of the 9th generation, Intel re-soldered the heat spreaders, as at least the processors presented so far all have a turbo clock of at least 4.6 GHz.

Product logos

See also

Web links

Individual evidence

  1. Core i9-9980HK ,
  2. Core i9-9980XE ,
  3. Test: Core i7-6950X and i7-6900K: Broadwell-E for Socket 2011-v3 in the test. In: PC Games Hardware , May 31, 2016.
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