Intel Celeron M

<<   Intel Celeron M
Logo of the Intel Celeron M
Production:	since 2004
Producer:	Intel
Processor clock:	600 MHz to 2.26 GHz
FSB cycle:	100 MHz to 133 MHz
L2 cache size:	512 KiB to 1 MiB
Instruction set :	x86 / Intel 64 ( AMD64 )
Microarchitecture :	Pentium M , core
Base: Socket 479 Socket M. Base P
Names of the processor cores: Banias Dothan Yonah Merom

Old logo of the Intel Celeron M

Intel Celeron M is the name of affordable versions of the Intel - mobile processors , based on the technology of the Intel Pentium M - Intel Core - or Intel Core 2 based processors. They replaced the Intel Mobile Celeron processors .

Technical

Like the CPUs based on the Core and Pentium M architecture, the Celeron M processors are based on a heavily modified version of the Pentium III , which in turn originally goes back to the Pentium Pro . The design is optimized for low electrical power consumption, which helps to extend the battery life in notebooks . In contrast to the Pentium M and the Intel Core architecture, the Celeron M lacks the advanced power-saving technologies SpeedStep and Deeper Sleep. In addition, with the FSB 400 or FSB 533, it has a slower connection to the rest of the system than the Core or Core 2 processors. On the other hand, however, the standard operating voltage is lower than that of the bigger brothers. Because of this and the slower clocked FSB , the electrical power consumption of the Celeron M family is only 21 instead of 27 watts, as is the case with the Pentium M with a Dothan core.

Model data socket 479

Banias-512

• L1 cache: 32 + 32  KiB (data + instructions)
• L2 cache: 512 KiB with processor clock
• MMX , SSE , SSE2
• Socket 479 , AGTL + with 100 MHz (quadpumped, FSB 400)
• Operating Voltage ( VCore ): 1.356 V; ULV : 1.004V
• Power dissipation ( TDP ): 24.5 W; ULV: 7 W.
• Release DATE: January 6, 2004
• Manufacturing technology: 130 nm
• Clock rates: Standard: 1.2–1.5 GHz; ULV: 600-900 MHz
• Model Numbers :
  • Standard models (TDP: 24.5 W):
    • 310: 1.2 GHz
    • 320: 1.3 GHz
    • 330: 1.4 GHz
    • 340: 1.5 GHz
  • ULV models (TDP: 7 W):
    • Celeron M ULV 800 MHz ^*
    • 333: 900 MHz
    • Celeron M ULV 600 MHz (only in Intel's industrial program) ^*

^* Released without the new model number introduced by Intel at the time

Dothan-512

• L1 cache: 32 + 32  KiB (data + instructions)
• L2 cache: 512 KiB with processor clock
• MMX , SSE , SSE2
• Socket 479 , AGTL + with 100 MHz (quadpumped, FSB 400)
• Operating voltage ( VCore ): 0.9V
• Power dissipation ( TDP ): 5–5.5 W ( ULV )
• Release DATE: July 2004
• Manufacturing technology: 90 nm
• Clock rates: 900–1000 MHz
• Model numbers
  • 353: 900 MHz (5.0 W TDP)
  • 373: 1000 MHz (5.5 W TDP)

Dothan-1024

Celeron M 360J (Dothan)

• L1 cache: 32 + 32  KiB (data + instructions)
• L2 cache: 1024 KiB with processor clock
• MMX , SSE , SSE2 , XD-Bit (models with "J" identification and from model 370 )
• Socket 479 , AGTL + with 100 MHz (quadpumped, FSB 400)
• Operating voltage ( VCore ): 1.26V
• Power dissipation ( TDP ): 5.5-21 W.
• Release DATE: July 2004
• Manufacturing technology: 90 nm
• Clock rates: 1.1–1.7 GHz
• Model Numbers :
  • Standard models with 21 W TDP
    • 350 (J): 1.3 GHz
    • 360 (J): 1.4 GHz
    • 370: 1.5 GHz
    • 380: 1.6 GHz
    • 390: 1.7 GHz (27 W TDP according to Intel data sheet)
  • ULV models with 5.5 W TDP
    • 383: 1.1 GHz

Model data base M

Yonah-1024

• L1 cache: 32 + 32  KiB (data + instructions)
• L2 cache: 1024 KiB with processor clock
• MMX , SSE , SSE2 , SSE3 , XD-Bit
• Socket M , AGTL + with 133 MHz (quadpumped, FSB 533)
• Operating voltage ( VCore ): 1.2625 V.
• Power dissipation ( TDP ): 5.5-27 W.
• Release DATE: April 2006
• Manufacturing technology: 65 nm
• Clock rates: 1.06–2.00 GHz
• Model Numbers :
  • Standard models with 27 W TDP
    • 410: 1.46 GHz
    • 420: 1.6 GHz
    • 430: 1.73 GHz
    • 440: 1.86 GHz
    • 450: 2.00 GHz
  • ULV models with 5.5 W TDP
    • 423: 1.06 GHz
    • 443: 1.20 GHz

Merom-1024

• L1 cache: 32 + 32  KiB (data + instructions)
• L2 cache: 1024 KiB with processor clock
• MMX , SSE , SSE2 , SSE3 , SSSE3 , Intel 64 , XD-Bit
• Socket M , AGTL + with 133 MHz (quadpumped, FSB 533)
• Operating voltage ( VCore ): 1.313 V.
• Power dissipation ( TDP ): 5.5-30 W.
• Release DATE: January 2007
• Manufacturing technology: 65 nm
• Clock rates: 933 MHz – 1.73 GHz
• Model Numbers :
  • Standard models with 26 W TDP
    • 520: 1.6 GHz
  • Standard models with 30 W TDP
    • 530: 1.73 GHz
  • ULV models with 5.5 W TDP
    • 523: 933 MHz

Model data socket P

Merom-1024

• L1 cache: 32 + 32  KiB (data + instructions)
• L2 cache: 1024 KiB with processor clock
• MMX , SSE , SSE2 , SSE3 , SSSE3 , Intel 64 , XD-Bit
• Socket P , AGTL + with 133 or 166 MHz (quadpumped, FSB 533 or FSB 667)
• Operating voltage ( VCore ): 0.95-1.30V
• Power dissipation ( TDP ): 30–31 W
• Release DATE: June 2007
• Manufacturing technology: 65 nm
• Clock rates: 1.73-2.26 GHz
• Model Numbers :
  • 30 W TDP, FSB 533
    • 530: 1.73 GHz
    • 540: 1.86 GHz
    • 550: 2.00 GHz
    • 560: 2.13 GHz
    • 570: 2.26 GHz
  • 31 W TDP, FSB 667
    • 575: 2.00 GHz
    • 585: 2.16 GHz

See also

• Notebook processor
• List of microprocessors
• AMD Mobile Sempron
• Intel Core Duo
• Intel Pentium M
• VIA / Centaur C3
• VIA / Centaur C7

Web links

• http://www.intel.de